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Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
ME-AA1-480-2I3-D12E-R2 Enclustra FPGA Solutions electronic component

ME-AA1-480-2I3-D12E-R2

SOM ARRIA 10 10AS048 4GB

Enclustra FPGA Solutions

0
RFQ

Datasheet

- Box Obsolete FPGA Core ARM® Dual-Core Cortex-A9 - 1.5GHz 16GB 4GB 168 Pin 2.910" L x 2.130" W (74.00mm x 54.00mm) -40°C ~ 85°C
A10S-P7-XXD-RC-SA Critical Link LLC electronic component

A10S-P7-XXD-RC-SA

IC MODULE CORTEX-A9 1.2GHZ 2GB

Critical Link LLC

0
RFQ

Datasheet

MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Arria 10 SX NEON™ SIMD 1.2GHz - 2GB Board-to-Board (BTB) 4.000" L x 4.000" W (101.50mm x 101.50mm) 0°C ~ 70°C
TE0820-05-5DI81MA Trenz Electronic GmbH electronic component

TE0820-05-5DI81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0813-01-5DI21-A Trenz Electronic GmbH electronic component

TE0813-01-5DI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0813-02-5DI81-A Trenz Electronic GmbH electronic component

TE0813-02-5DI81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

0
RFQ

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
AM0010-02-5DI21MA Trenz Electronic GmbH electronic component

AM0010-02-5DI21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU5EV-1I - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) -40°C ~ 85°C
ME-XU5-5EV-2I-D12E-R1.2 Enclustra FPGA Solutions electronic component

ME-XU5-5EV-2I-D12E-R1.2

SOM ZYNQ US+ ZU5EV 4GB+1GB PL

Enclustra FPGA Solutions

0
RFQ

Datasheet

- Box Obsolete MPU, FPGA Core ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU - 600MHz, 1.5GHz 16GB 1GB, 4GB 168 Pin 2.200" L x 2.130" W (56.00mm x 54.00mm) -40°C ~ 85°C
TE0741-04-G2I-1-A Trenz Electronic GmbH electronic component

TE0741-04-G2I-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

0
RFQ

Datasheet

- Box Obsolete FPGA Core Xilinx Kintex-7 FPGA XC7K410T-2FBG676I - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0818-01-9GI21-A Trenz Electronic GmbH electronic component

TE0818-01-9GI21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0818-01-BBE21-A Trenz Electronic GmbH electronic component

TE0818-01-BBE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0841-02-31I21-A Trenz Electronic GmbH electronic component

TE0841-02-31I21-A

IC MODULE

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0841 Bulk Discontinued at Digi-Key FPGA Core Kintex UltraScale KU035 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
IW-G30M-C7EV-4E004G-E008G-BEA iWave Global electronic component

IW-G30M-C7EV-4E004G-E008G-BEA

ZU7EV (-1 SPEED) MPSOC SOM

iWave Global

1
RFQ

Datasheet

- Bulk Active - ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV - 1.5GHz - - - 3.740" x 2.950" (94.99mm x 74.93mm) -20°C ~ 85°C
TE0808-05-9GI81-A Trenz Electronic GmbH electronic component

TE0808-05-9GI81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0745-02-92I31-A Trenz Electronic GmbH electronic component

TE0745-02-92I31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0808-05-BBE81-A Trenz Electronic GmbH electronic component

TE0808-05-BBE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-BBE21-A Trenz Electronic GmbH electronic component

TE0808-05-BBE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

TE0808 Bulk Obsolete MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-BBE21-E Trenz Electronic GmbH electronic component

TE0808-05-BBE21-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0808-05-9GI21-E Trenz Electronic GmbH electronic component

TE0808-05-9GI21-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0741-05-G2I-1-A Trenz Electronic GmbH electronic component

TE0741-05-G2I-1-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K410T-2FBG676I - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0745-02-92I31-AK Trenz Electronic GmbH electronic component

TE0745-02-92I31-AK

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
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Microcontrollers, Microprocessor, FPGA Modules Electronic Components

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