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Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0803-04-5DE11-A Trenz Electronic GmbH electronic component

TE0803-04-5DE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0813-01-5DE11-A Trenz Electronic GmbH electronic component

TE0813-01-5DE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0817-01-4AI21-A Trenz Electronic GmbH electronic component

TE0817-01-4AI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU4CG-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0813-02-5DE81-A Trenz Electronic GmbH electronic component

TE0813-02-5DE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

0
RFQ

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE81-L Trenz Electronic GmbH electronic component

TE0808-05-9BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

TE0808 Bulk Active MPU Core - - - 128MB 4GB - 2.990" L x 2.050" W (76.00mm x 52.00mm) -
TE0808-05-9BE21-L Trenz Electronic GmbH electronic component

TE0808-05-9BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE21-F Trenz Electronic GmbH electronic component

TE0808-05-9BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0818-01-9BE21-A Trenz Electronic GmbH electronic component

TE0818-01-9BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
AM0010-02-5DE21MA Trenz Electronic GmbH electronic component

AM0010-02-5DE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU5EV-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
TE0808-05-9BE81-A Trenz Electronic GmbH electronic component

TE0808-05-9BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0808 Bulk Discontinued at Digi-Key MPU Core - - - 128MB 4GB - 2.990" L x 2.050" W (76.00mm x 52.00mm) -
TE0808-05-9BE21-E Trenz Electronic GmbH electronic component

TE0808-05-9BE21-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0807-03-4AI21-A Trenz Electronic GmbH electronic component

TE0807-03-4AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU4CG-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0808-04-9BE21-L Trenz Electronic GmbH electronic component

TE0808-04-9BE21-L

IC MOD SOM MPSOC 4GB XCZU9EG

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0808 Box Active MPU Core - - - 128MB 4GB B2B - -
TE0808-05-9BE21-LZ Trenz Electronic GmbH electronic component

TE0808-05-9BE21-LZ

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-9BE81-A Trenz Electronic GmbH electronic component

TE0818-02-9BE81-A

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE81-AK Trenz Electronic GmbH electronic component

TE0808-05-9BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
ME-AA1-480-2I3-D12E-NFX3-R2 Enclustra FPGA Solutions electronic component

ME-AA1-480-2I3-D12E-NFX3-R2

SOM ARRIA 10 10AS048 4GB

Enclustra FPGA Solutions

0
RFQ

Datasheet

- Bulk Active - - - - - - - - -
TE0807-03-7DI21-A Trenz Electronic GmbH electronic component

TE0807-03-7DI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0741-05-G2C-1-A Trenz Electronic GmbH electronic component

TE0741-05-G2C-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

0
RFQ

-

Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K410T-2FBG676C - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0841-02-31C21-A Trenz Electronic GmbH electronic component

TE0841-02-31C21-A

IC MODULE

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0841 Bulk Discontinued at Digi-Key FPGA Core Kintex UltraScale KU035 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
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Microcontrollers, Microprocessor, FPGA Modules Electronic Components

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