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Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0745-02-91C31-A Trenz Electronic GmbH electronic component

TE0745-02-91C31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0745 Bulk Obsolete MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0817-01-4BE21-A Trenz Electronic GmbH electronic component

TE0817-01-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
IW-G30M-C4CG-4E002G-E008G-BIA iWave Global electronic component

IW-G30M-C4CG-4E002G-E008G-BIA

ZU4CG (-1 Speed) MPSoC SOM

iWave Global

1
RFQ

Datasheet

Zynq® UltraScale+™ Bulk Active MPU, FPG ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) ARM® Mali 400 MP2 1.5GHz, 600MHz 8GB eMMC 4GB, 1GB 2 x 240 Pin 4.330" L x 2.950" W (110.00mm x 75.00mm) -40°C ~ 85°C
TE0820-05-4DI81MA Trenz Electronic GmbH electronic component

TE0820-05-4DI81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0807-03-4BE21-A Trenz Electronic GmbH electronic component

TE0807-03-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0807-03-4BE21-AK Trenz Electronic GmbH electronic component

TE0807-03-4BE21-AK

MPSOC MODULE TE0807 WITH ZYNQ UL

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-L Trenz Electronic GmbH electronic component

TE0808-05-6BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-L Trenz Electronic GmbH electronic component

TE0808-05-6BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-F Trenz Electronic GmbH electronic component

TE0808-05-6BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-01-6BE21-A Trenz Electronic GmbH electronic component

TE0818-01-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-6BE81-A Trenz Electronic GmbH electronic component

TE0818-02-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-A Trenz Electronic GmbH electronic component

TE0808-05-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-A Trenz Electronic GmbH electronic component

TE0808-05-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE81-E Trenz Electronic GmbH electronic component

TE0808-05-6BE81-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0808-04-6BE21-L Trenz Electronic GmbH electronic component

TE0808-04-6BE21-L

IC MOD SOM MPSOC 4GB XCZU6EG

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-05-6BE81-AK Trenz Electronic GmbH electronic component

TE0808-05-6BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-AK Trenz Electronic GmbH electronic component

TE0808-05-6BE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

0
RFQ

-

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-04-6BE21-AK Trenz Electronic GmbH electronic component

TE0808-04-6BE21-AK

IC MOD SOM MPSOC 4GB ZU6EG

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0807-03-5AI21-A Trenz Electronic GmbH electronic component

TE0807-03-5AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

0
RFQ

Datasheet

- Box Active - - - - - - - - -
MOD5270BXX NXP USA Inc. electronic component

MOD5270BXX

IC MOD COLDFIRE 95MHZ 2.064MB

NXP USA Inc.

0
RFQ

-

- Bulk Obsolete MCU, Ethernet Core ColdFire 5270 - 95MHz 512KB 2.064MB RJ-45, 2x50 Header 2.600" L x 2.000" W (66.04mm x 50.80mm) 0°C ~ 70°C
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Microcontrollers, Microprocessor, FPGA Modules Electronic Components

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