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Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0820-05-3BI21ML Trenz Electronic GmbH electronic component

TE0820-05-3BI21ML

MOD MPSOC 2GB DDR4

Trenz Electronic GmbH

0
RFQ

-

TE0820 Bulk Last Time Buy MPU Core - - - 8GB eMMC, 128MB QSPI 2GB - - -
20-101-1314 Digi electronic component

20-101-1314

MODULE ETHERNET OP7300

Digi

0
RFQ

-

- Bulk Obsolete - - - - - - - - -
5CSX-H5-4YA-RI Critical Link LLC electronic component

5CSX-H5-4YA-RI

IC MOD CORTEX-A9 800MHZ 1GB 32MB

Critical Link LLC

0
RFQ

Datasheet

MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 32MB 1GB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) -40°C ~ 85°C
TE0821-01-3AE31PA Trenz Electronic GmbH electronic component

TE0821-01-3AE31PA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 4GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
5CSX-H6-53B-RC Critical Link LLC electronic component

5CSX-H6-53B-RC

IC MOD CORTEX-A9 800MHZ 512MB

Critical Link LLC

0
RFQ

Datasheet

MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 48MB 512MB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) 0°C ~ 70°C
AM0010-02-3BE21MA Trenz Electronic GmbH electronic component

AM0010-02-3BE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU3EG-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) 0°C ~ 85°C
TE0745-02-71I31-AK Trenz Electronic GmbH electronic component

TE0745-02-71I31-AK

MOD SOM DDR3L 1GB HEAT SPREADER

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7030) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.990" L x 2.130" W (76.00mm x 54.00mm) -40°C ~ 85°C
TE0803-02-03EG-1EB Trenz Electronic GmbH electronic component

TE0803-02-03EG-1EB

IC MODULE ZYNQ USCALE 4GB 128MB

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0813-01-4DE11-AZ Trenz Electronic GmbH electronic component

TE0813-01-4DE11-AZ

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

- Bulk Obsolete - - - - - - - - -
TE0745-03-71I31-AK Trenz Electronic GmbH electronic component

TE0745-03-71I31-AK

SOM WITH AMD ZYNQ 7030-1I AND HE

Trenz Electronic GmbH

0
RFQ

-

Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7030 SoC XC7Z030-1FBG676I - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0803-04-4DE11-A Trenz Electronic GmbH electronic component

TE0803-04-4DE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4EV-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0821-01-3BI21MA Trenz Electronic GmbH electronic component

TE0821-01-3BI21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU3EG-1SFVC784I ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 2 x 160 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0820-05-4DE81MA Trenz Electronic GmbH electronic component

TE0820-05-4DE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

- Bulk Active - - - - - - - - -
TE0813-01-4DE11-A Trenz Electronic GmbH electronic component

TE0813-01-4DE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU4EV-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0813-02-4DE81-A Trenz Electronic GmbH electronic component

TE0813-02-4DE81-A

TE0813-02-4DE81-A STARTER KIT

Trenz Electronic GmbH

0
RFQ

-

Kintex™-7 Bulk Active FPGA Zynq™ UltraScale+™ ZU4EV - - 128MB 4GB BGA 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
AM0010-02-3BI21MA Trenz Electronic GmbH electronic component

AM0010-02-3BI21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU3EG-1I - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) -40°C ~ 85°C
L138-DG-325-RI Critical Link LLC electronic component

L138-DG-325-RI

MITYDSP-L138F SOM W/ OMAP-L138

Critical Link LLC

0
RFQ

Datasheet

MityDSP-L138F Bag Obsolete MPU, DSP, FPGA Core ARM926EJ-S, OMAP-L138 TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) 375MHz 256MB (NAND), 16MB (NOR) 128MB SO-DIMM-200 2.660" L x 2.000" W (67.60mm x 50.80mm) -40°C ~ 85°C
AM0010-02-4DE21MA Trenz Electronic GmbH electronic component

AM0010-02-4DE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0
RFQ

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU4EV - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
TE0803-01-04CG-1EA Trenz Electronic GmbH electronic component

TE0803-01-04CG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

0
RFQ

Datasheet

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 2GB B2B 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
EC-VA-H264-10B-60-1080-MD00C-A200T System-On-Chip (SOC) Technologies Inc. electronic component

EC-VA-H264-10B-60-1080-MD00C-A200T

MOD H264 ENC 60FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0
RFQ

Datasheet

- Box Active DSP, FPGA Core - Xilinx Artix-7 XC7A200T - 32MB 512MB SO-DIMM - -
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Microcontrollers, Microprocessor, FPGA Modules Electronic Components

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