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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
23-60FSV50-BD-24 Leader Tech Inc. electronic component

23-60FSV50-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0097065617 Laird Technologies EMI electronic component

0097065617

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0
RFQ

-

Clip-On Bulk Active Fingerstock - 0.543" (13.80mm) 15.984" (406.00mm) 0.125" (3.18mm) Beryllium Copper Tin 299.99µin (7.62µm) Clip 121°C
25-78FSV50-BD-24 Leader Tech Inc. electronic component

25-78FSV50-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.780" (19.81mm) 24.000" (609.60mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
6-34UT-070-DL-BD-16 Leader Tech Inc. electronic component

6-34UT-070-DL-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.220" (5.59mm) 16.000" (406.40mm) 0.060" (1.52mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
23-60FS-BD-24-NTP Leader Tech Inc. electronic component

23-60FS-BD-24-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
28-49U-BD-16 Leader Tech Inc. electronic component

28-49U-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.490" (12.44mm) 16.000" (406.40mm) 0.280" (7.11mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
8563-0116-50 Laird Technologies EMI electronic component

8563-0116-50

RFI GASKET

Laird Technologies EMI

0
RFQ

Datasheet

Electroseal™ EcE50 Bulk Active Gasket Round 0.610" (15.49mm) - 0.070" (1.78mm) - - - - -
16-44UD-BD-16 Leader Tech Inc. electronic component

16-44UD-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.440" (11.18mm) 16.000" (406.40mm) 0.016" (0.41mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
23-S-60FSV50-BD-24 Leader Tech Inc. electronic component

23-S-60FSV50-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

-

- Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
8563-0404-81 Laird Technologies EMI electronic component

8563-0404-81

DRING,ECE081

Laird Technologies EMI

0
RFQ

-

- Bulk Active - - - - - - - - - -
81-01-32AS1-2000 Parker Chomerics electronic component

81-01-32AS1-2000

RFI FINGERSTOCK BECU UNPLAT ADH

Parker Chomerics

0
RFQ

Datasheet

- Tube Active Fingerstock - 0.600" (15.24mm) 17.992" (457.00mm) 0.220" (5.59mm) Beryllium Copper Unplated - Non-Conductive Adhesive -40°C ~ 121°C
23-60FS-BD-24 Leader Tech Inc. electronic component

23-60FS-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-S-78FSV50-BD-24 Leader Tech Inc. electronic component

25-S-78FSV50-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.780" (19.81mm) 24.000" (609.60mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
11-89RA-BD-16 Leader Tech Inc. electronic component

11-89RA-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.890" (22.61mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
4048AB51H09600 Laird Technologies EMI electronic component

4048AB51H09600

RFI FOF GASKET PU

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Square 0.236" (6.00mm) 96.000" (2.44m) 0.236" (6.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - - -
37-131-1010-09600 Parker Chomerics electronic component

37-131-1010-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 1.890" (48.01mm) 8.00' (2.44m) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
10-04-2737-6502 Parker Chomerics electronic component

10-04-2737-6502

RFI GASKET ELASTOMER NICKEL

Parker Chomerics

0
RFQ

Datasheet

- Spool Active Gasket Round 0.250" (6.35mm) 12.000" (304.80mm) - Conductive Elastomer Nickel - No Adhesive -29°C ~ 66°C
4084AB51H04800 Laird Technologies EMI electronic component

4084AB51H04800

RFI FOF GASKET PU

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Square 0.500" (12.70mm) 48.000" (121.92cm) 0.500" (12.70mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - - -
4570AB01K09600 Laird Technologies EMI electronic component

4570AB01K09600

RFI FOF GASKET PU

Laird Technologies EMI

0
RFQ

Datasheet

I/O Gasket Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 96.000" (2.44m) 0.016" (0.40mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
23-76FSC-BD-24 Leader Tech Inc. electronic component

23-76FSC-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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