Hello! Welcome to Raywise Technologies Co.,Limited!

RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
0C98053817 Laird Technologies EMI electronic component

0C98053817

AP,COIL,SNB,USFT,PSA .250X.780X.

Laird Technologies EMI

0
RFQ

-

- Bulk Active - - - - - - - - - -
0097065419 Laird Technologies EMI electronic component

0097065419

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

-

- Bulk Active Fingerstock - - 12.000" (304.80mm) 0.064" (1.63mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
14-45DTS-BD-15-NTP Leader Tech Inc. electronic component

14-45DTS-BD-15-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.450" (11.43mm) 15.000" (381.00mm) 0.140" (3.56mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109FSDS-BD-24 Leader Tech Inc. electronic component

25-109FSDS-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 1.090" (27.69mm) 24.000" (609.60mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
6-S-34TV-BD-24 Leader Tech Inc. electronic component

6-S-34TV-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.060" (1.52mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109C-070-BD-16 Leader Tech Inc. electronic component

25-109C-070-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109C-120-BD-16 Leader Tech Inc. electronic component

25-109C-120-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109C-130-BD-16 Leader Tech Inc. electronic component

25-109C-130-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0097065519 Laird Technologies EMI electronic component

0097065519

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Clip-On Bulk Active Fingerstock - - - - Beryllium Copper - - Slot 121°C
3-20T-ZNC-24 Leader Tech Inc. electronic component

3-20T-ZNC-24

RFI FINGERSTOCK BECU ZINC ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.200" (5.08mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Zinc + Clear Chromate Flash Adhesive -55°C ~ 121°C
0097064017 Laird Technologies EMI electronic component

0097064017

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0
RFQ

-

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.330" (8.38mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
10-30C-050-DL-BD-16 Leader Tech Inc. electronic component

10-30C-050-DL-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

TechMESH Bulk Active Fingerstock - 0.300" (7.62mm) 16.000" (406.40mm) 0.100" (2.54mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0097043502 Laird Technologies EMI electronic component

0097043502

FINGERSTOCK BECU 24X64MM

Laird Technologies EMI

0
RFQ

-

- Box Obsolete - Angled 0.945" (24.00mm) 2.520" (64.00mm) - - - - - -
4090PA51H09600 Laird Technologies EMI electronic component

4090PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

51H Bulk Active Fabric Over Foam D-Shape 0.090" (2.29mm) 8.00' (2.44m) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
32-S-78AH-BD-16 Leader Tech Inc. electronic component

32-S-78AH-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.780" (19.81mm) 16.000" (406.40mm) 0.320" (8.13mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
20-38RBCT-SN-16 Leader Tech Inc. electronic component

20-38RBCT-SN-16

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.200" (5.08mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
4-53D-BD-16 Leader Tech Inc. electronic component

4-53D-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.530" (13.46mm) 16.000" (406.40mm) 0.040" (1.02mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
4320AC51G04800 Laird Technologies EMI electronic component

4320AC51G04800

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

51G Bulk Active Fabric Over Foam D-Shape 0.140" (3.56mm) 4.00' (1.22m) 0.050" (1.27mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
8-92RC-BD-16 Leader Tech Inc. electronic component

8-92RC-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.920" (23.37mm) 16.000" (406.40mm) 0.080" (2.03mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0098065517 Laird Technologies EMI electronic component

0098065517

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0
RFQ

-

Ultrasoft Clip-On Bulk Active Fingerstock - - 11.945" (303.40mm) 0.305" (7.75mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
Total 4130 Record«Prev1... 146147148149150151152153...207Next»

RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

Explore RFI and EMI - Contacts, Fingerstock and Gaskets electronic components, related subcategories, product specifications, datasheets and sourcing options. We support original component procurement, BOM sourcing and RFQ services for engineers, distributors and global buyers.

Frequently Asked Questions