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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
8516-9212-56 Laird Technologies EMI electronic component

8516-9212-56

RFI GASKET ADH

Laird Technologies EMI

0
RFQ

Datasheet

D Connector Bulk Active Gasket Rectangle 0.800" (20.32mm) 2.840" (72.14mm) 0.030" (0.76mm) - - - Adhesive -
30508/1000 Würth Elektronik electronic component

30508/1000

RFI GASKET SLV NI/CU

Würth Elektronik

0
RFQ

-

WE-ST Bulk Active Gasket Sleeve - 0.315" (8.00mm) - 0.005" (0.13mm) Nickel-Copper (NI/CU) Glass Fiber - - - -60°C ~ 160°C
6-34UT-070-BD-16 Leader Tech Inc. electronic component

6-34UT-070-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.220" (5.59mm) 16.000" (406.40mm) 0.060" (1.52mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0097054019 Laird Technologies EMI electronic component

0097054019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
4-34D-BD-16 Leader Tech Inc. electronic component

4-34D-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.300" (7.62mm) 16.000" (406.40mm) 0.040" (1.02mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
37-131-1038-09600 Parker Chomerics electronic component

37-131-1038-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 1.000" (25.40mm) 8.00' (2.44m) 0.262" (6.66mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
5409-0006-20 Leader Tech Inc. electronic component

5409-0006-20

.250"WX.062"H SOLID RECT--5409-0

Leader Tech Inc.

0
RFQ

Datasheet

5401 Bag Active Gasket Rectangle 0.250" (6.35mm) 25.00' (7.62m) 0.062" (1.58mm) Silver/Aluminum Fluorosilicone Elastomer - - Adhesive -55°C ~ 160°C
0097052017 Laird Technologies EMI electronic component

0097052017

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0
RFQ

Datasheet

All-Purpose Bulk Active Fingerstock - 0.370" (9.40mm) 15.984" (406.00mm) 0.140" (3.56mm) Beryllium Copper Tin 299.99µin (7.62µm) Adhesive 121°C
0097052019 Laird Technologies EMI electronic component

0097052019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

All-Purpose Bulk Active Fingerstock - 0.370" (9.40mm) 15.984" (406.00mm) 0.140" (3.56mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
37-131-1044-09600 Parker Chomerics electronic component

37-131-1044-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 0.512" (13.01mm) 8.00' (2.44m) 0.512" (13.00mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
5409-0006-40 Leader Tech Inc. electronic component

5409-0006-40

.250"WX.062"H SOLID RECT--5409-0

Leader Tech Inc.

0
RFQ

Datasheet

5401 Bag Active Gasket Rectangle 0.250" (6.35mm) 25.00' (7.62m) 0.062" (1.58mm) Silver/Aluminum Fluorosilicone Elastomer - - Adhesive -55°C ~ 160°C
4-38D-BD-16 Leader Tech Inc. electronic component

4-38D-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.040" (1.02mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
81-02-14449-2000 Parker Chomerics electronic component

81-02-14449-2000

RFI FINGERSTOCK BECU UNPLAT ADH

Parker Chomerics

0
RFQ

Datasheet

- Tube Active Fingerstock - 0.500" (12.70mm) 15.984" (406.00mm) 0.120" (3.05mm) Beryllium Copper Unplated - Adhesive -40°C ~ 121°C
4616AD51H09600 Laird Technologies EMI electronic component

4616AD51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active Fabric Over Foam - - 8.00' (2.44m) - Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
8508039456 Laird Technologies EMI electronic component

8508039456

MILCONNECTOR MIM613

Laird Technologies EMI

0
RFQ

-

* Bulk Active - - - - - - - - - -
4094AB51S04800 Laird Technologies EMI electronic component

4094AB51S04800

RFI FOF GASKET

Laird Technologies EMI

0
RFQ

Datasheet

51S Bulk Active Fabric Over Foam Rectangle 0.161" (4.10mm) 48.000" (121.92cm) 0.079" (2.00mm) - - - - -
4694AB51K04800 Laird Technologies EMI electronic component

4694AB51K04800

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

51K Bulk Active Fabric Over Foam Rectangle 0.500" (12.70mm) 4.00' (1.22m) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
8508-9191-56 Laird Technologies EMI electronic component

8508-9191-56

EMOW SILSD MON STR PSA

Laird Technologies EMI

0
RFQ

-

- Bulk Active - - - - - - - - - -
11-28FSV23-BD-16 Leader Tech Inc. electronic component

11-28FSV23-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0097094102 Laird Technologies EMI electronic component

0097094102

RFI FINGERSTOCK BECU SNAP-IN

Laird Technologies EMI

0
RFQ

Datasheet

Flexible Low Compression Box Active Fingerstock - 0.195" (4.95mm) 24.000" (609.60mm) 0.170" (4.32mm) Beryllium Copper - - Snap-In 121°C
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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