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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
0098054002 Laird Technologies EMI electronic component

0098054002

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0
RFQ

-

Ultrasoft All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper - - Adhesive 121°C
0097054017 Laird Technologies EMI electronic component

0097054017

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0
RFQ

Datasheet

All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Adhesive 121°C
4520AC51K09600 Laird Technologies EMI electronic component

4520AC51K09600

RFI FOF GASKET PU

Laird Technologies EMI

0
RFQ

Datasheet

51K Bulk Active Fabric Over Foam Square 2.000" (50.80mm) 96.000" (2.44m) 2.000" (50.80mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
25-78FS-BD-85.875-NTP Leader Tech Inc. electronic component

25-78FS-BD-85.875-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.780" (19.81mm) 85.920" (2.18m) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0078007217 Laird Technologies EMI electronic component

0078007217

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Ultrasoft Hook-on Bulk Active Fingerstock - 0.600" (15.24mm) 16.200" (411.48mm) 0.152" (3.86mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
4688PA51H09600 Laird Technologies EMI electronic component

4688PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.118" (3.00mm) 96.000" (2.44m) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
37-131-1007-09600 Parker Chomerics electronic component

37-131-1007-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 1.614" (41.00mm) 8.00' (2.44m) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
0097054219 Laird Technologies EMI electronic component

0097054219

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 15.984" (406.00mm) 0.080" (2.03mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
0097060719 Laird Technologies EMI electronic component

0097060719

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

0
RFQ

-

- Bulk Active Fingerstock - - 16.000" (406.40mm) 0.170" (4.32mm) Beryllium Copper Nickel 299.21µin (7.60µm) Clip 121°C
0098053817 Laird Technologies EMI electronic component

0098053817

AP,STR,SNB,USF,PSA/.250X.780X.37

Laird Technologies EMI

0
RFQ

-

* Bulk Active - - - - - - - - - -
0C97044017 Laird Technologies EMI electronic component

0C97044017

RFI FINGERSTOCK BECU TIN HARDWR

Laird Technologies EMI

0
RFQ

Datasheet

Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Tin 299.99µin (7.62µm) Hardware, Rivet, Solder 121°C
8516-0359-56 Laird Technologies EMI electronic component

8516-0359-56

MILCONNECTOR,MIM613 35.12X30.15X

Laird Technologies EMI

0
RFQ

-

MIL Connector Bulk Active - - - - - - - - - -
8864-0110-93 Laird Technologies EMI electronic component

8864-0110-93

RFI GASKET

Laird Technologies EMI

0
RFQ

-

Electroseal™ Bulk Active Gasket Round 0.250" (6.35mm) - 0.250" (6.35mm) - - - - -
4358PA51G09600 Laird Technologies EMI electronic component

4358PA51G09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

51G Bulk Active Fabric Over Foam D-Shape 0.098" (2.49mm) 8.00' (2.44m) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 85°C
0098051502 Laird Technologies EMI electronic component

0098051502

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0
RFQ

-

Ultrasoft Foldover Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper - 299.21µin (7.60µm) Adhesive 121°C
4912PA51H08400 Laird Technologies EMI electronic component

4912PA51H08400

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

ECOGREEN™ Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 7.00' (2.13m) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
13-30RH-SN-0.356 Leader Tech Inc. electronic component

13-30RH-SN-0.356

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.300" (7.62mm) 0.356" (9.04mm) 0.130" (3.30mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
3-S-23T-BD-24-NTP Leader Tech Inc. electronic component

3-S-23T-BD-24-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
7-19PCI-SS-14.6 Leader Tech Inc. electronic component

7-19PCI-SS-14.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.180" (4.57mm) 14.600" (370.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
7-19PCI-SS-4.6 Leader Tech Inc. electronic component

7-19PCI-SS-4.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.180" (4.57mm) 4.600" (116.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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