Hello! Welcome to Raywise Technologies Co.,Limited!

RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
8200-9055-81 Leader Tech Inc. electronic component

8200-9055-81

RFI GASKET ELASTOMER

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Gasket - - - - Conductive Elastomer - - - -62°C ~ 260°C
0097056019 Laird Technologies EMI electronic component

0097056019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

-

- Bulk Active Fingerstock - 0.190" (4.83mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097055519 Laird Technologies EMI electronic component

0097055519

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

Twist Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0077001417 Laird Technologies EMI electronic component

0077001417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0
RFQ

-

77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0077001419 Laird Technologies EMI electronic component

0077001419

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

-

77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
37-131-1039-09600 Parker Chomerics electronic component

37-131-1039-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 0.591" (15.00mm) 8.00' (2.44m) 0.387" (9.83mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
0097056417 Laird Technologies EMI electronic component

0097056417

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0
RFQ

Datasheet

Clip-On Twist Bulk Active Fingerstock - 0.210" (5.33mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
0098054102 Laird Technologies EMI electronic component

0098054102

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0
RFQ

-

Ultrasoft Foldover Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.120" (3.05mm) Beryllium Copper - - Adhesive 121°C
0098095417 Laird Technologies EMI electronic component

0098095417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0
RFQ

-

Ultrasoft Symmetrical (S3) Slotted Bulk Active Fingerstock - 0.450" (11.43mm) 15.000" (381.00mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
4208PA51G07200 Laird Technologies EMI electronic component

4208PA51G07200

RFI FOF GASKET ADH

Laird Technologies EMI

0
RFQ

Datasheet

51G Bulk Active Fabric Over Foam Rectangle 0.394" (10.00mm) 72.000" (182.88cm) 1.000" (25.40mm) - - - Adhesive -
8516-0120-72 Laird Technologies EMI electronic component

8516-0120-72

RFI GASKET

Laird Technologies EMI

0
RFQ

-

Electroseal™ Bulk Active Gasket - 1.031" (26.19mm) - - - - - - -
0097055919 Laird Technologies EMI electronic component

0097055919

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

Twist Bulk Active Fingerstock - 0.300" (7.62mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
11-45CD-BD-16 Leader Tech Inc. electronic component

11-45CD-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.450" (11.43mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
387012273 Laird Technologies EMI electronic component

387012273

UFR,BECU,SBNI,RL 0.5

Laird Technologies EMI

0
RFQ

-

Ultraflex Bulk Active - - - - - - - - - -
0C98044002 Laird Technologies EMI electronic component

0C98044002

RFI FINGERSTOCK BECU UNPLAT ADH

Laird Technologies EMI

0
RFQ

-

Ultrasoft Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Unplated - Adhesive 121°C
0097029019 Laird Technologies EMI electronic component

0097029019

RFI FINGERSTOCK NICKEL

Laird Technologies EMI

0
RFQ

-

- Bulk Active Fingerstock - - - - - Nickel 299.21µin (7.60µm) - 121°C
13-37AH-BD-16 Leader Tech Inc. electronic component

13-37AH-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.370" (9.40mm) 16.000" (406.40mm) 0.130" (3.30mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
14-S-37FSV30-BD-16 Leader Tech Inc. electronic component

14-S-37FSV30-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

-

- Bulk Active Fingerstock - 0.370" (9.40mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
7-13U-BD-12 Leader Tech Inc. electronic component

7-13U-BD-12

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.130" (3.30mm) 12.000" (304.80mm) 0.070" (1.78mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
4358PA51H09600 Laird Technologies EMI electronic component

4358PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active Fabric Over Foam D-Shape 0.098" (2.50mm) 96.000" (2.44m) 0.059" (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
Total 4130 Record«Prev1... 138139140141142143144145...207Next»

RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

Explore RFI and EMI - Contacts, Fingerstock and Gaskets electronic components, related subcategories, product specifications, datasheets and sourcing options. We support original component procurement, BOM sourcing and RFQ services for engineers, distributors and global buyers.

Frequently Asked Questions