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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
92-22009 TE Connectivity AMP Connectors electronic component

92-22009

RFI GASKET SIL

TE Connectivity AMP Connectors

11
RFQ

Datasheet

- Bag Active Gasket Sheet 1.750" (44.45mm) 1.750" (44.45mm) 0.031" (0.80mm) Silicone Nickel Graphite - - - -55°C ~ 160°C
0098060702 Laird Technologies EMI electronic component

0098060702

RFI FINGERSTOCK BECU CLIP

Laird Technologies EMI

0
RFQ

Datasheet

Ultrasoft Clip-On Bulk Active Fingerstock - 0.330" (8.38mm) 16.000" (406.40mm) 0.280" (7.11mm) Beryllium Copper - - Clip 121°C
0097055019 Laird Technologies EMI electronic component

0097055019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

Twist Bulk Active Fingerstock - 0.230" (5.84mm) 23.976" (609.00mm) 0.030" (0.76mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
0097055119 Laird Technologies EMI electronic component

0097055119

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

Twist Bulk Active Fingerstock - 0.160" (4.06mm) 23.976" (609.00mm) 0.030" (0.76mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
0097097217 Laird Technologies EMI electronic component

0097097217

DES,STR,SNB,CLO

Laird Technologies EMI

0
RFQ

Datasheet

Divider Edge Bulk Active - - 0.062" (1.59mm) 12.000" (304.80mm) - - - - - -
0097097219 Laird Technologies EMI electronic component

0097097219

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

0
RFQ

Datasheet

Divider Edge Bulk Active Fingerstock - 0.060" (1.52mm) 12.008" (305.00mm) 0.052" (1.32mm) Beryllium Copper Nickel 299.99µin (7.62µm) Clip -
7-21C-045-DL-CDC-16 Leader Tech Inc. electronic component

7-21C-045-DL-CDC-16

RFI FINGERSTOCK BECU CADMIUM ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.250" (6.35mm) 16.000" (406.40mm) 0.070" (1.78mm) Beryllium Copper Cadmium + Clear Chromate Flash Adhesive -55°C ~ 121°C
0097054102 Laird Technologies EMI electronic component

0097054102

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0
RFQ

Datasheet

Foldover Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.120" (3.05mm) Beryllium Copper - - Adhesive 121°C
81-01-14309-2000 Parker Chomerics electronic component

81-01-14309-2000

RFI FINGERSTOCK BECU UNPLAT ADH

Parker Chomerics

0
RFQ

Datasheet

- Tube Active Fingerstock - 0.561" (14.24mm) 15.748" (400.00mm) 0.220" (5.59mm) Beryllium Copper Unplated - Non-Conductive Adhesive -40°C ~ 121°C
0097060317 Laird Technologies EMI electronic component

0097060317

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0
RFQ

-

- Bulk Active Fingerstock - - 16.000" (406.40mm) 0.300" (7.62mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
0097095717 Laird Technologies EMI electronic component

0097095717

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0
RFQ

Datasheet

Symmetrical (S3) Slotted Bulk Active Fingerstock - 0.350" (8.89mm) 15.000" (381.00mm) 0.110" (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
4519PAX1R03937 Laird Technologies EMI electronic component

4519PAX1R03937

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

Datasheet

EcoTemp™ 85 X1R Bulk Active Fabric Over Foam - - 39.370" (1.00m) - Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 85°C
8516-9208-56 Laird Technologies EMI electronic component

8516-9208-56

DSUBGASKET MIM613 PSA

Laird Technologies EMI

0
RFQ

Datasheet

* Bulk Active - - - - - - - - - -
0098053602 Laird Technologies EMI electronic component

0098053602

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0
RFQ

-

Ultrasoft All-Purpose Bulk Active Fingerstock - 0.670" (17.02mm) 24.000" (609.60mm) 0.310" (7.87mm) Beryllium Copper - - Adhesive 121°C
0097065417 Laird Technologies EMI electronic component

0097065417

DES,STR,SNB,CLO

Laird Technologies EMI

0
RFQ

Datasheet

Divider Edge Bulk Active - - 0.183" (4.65mm) 12.000" (304.80mm) - - - - - -
0098055019 Laird Technologies EMI electronic component

0098055019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

Datasheet

Ultrasoft Twist Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097013402 Laird Technologies EMI electronic component

0097013402

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Contact Strip Bulk Active Fingerstock - - - - Beryllium Copper - - Slot 121°C
0098097617 Laird Technologies EMI electronic component

0098097617

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

-

Ultrasoft Clip-On Longitudinal Grounding Bulk Active Fingerstock - - - - Beryllium Copper - - Slot 121°C
0097053719 Laird Technologies EMI electronic component

0097053719

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0
RFQ

-

- Bulk Active Fingerstock - 1.130" (28.70mm) 12.000" (304.80mm) 0.410" (10.41mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
37-131-1040-09600 Parker Chomerics electronic component

37-131-1040-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 0.787" (20.00mm) 8.00' (2.44m) 0.387" (9.83mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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