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Power Management - Specialized

Photo Mfr. Part # Availability Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MAX16948AGEE/V+ Analog Devices Inc./Maxim Integrated electronic component

MAX16948AGEE/V+

AUTOMOTIVE DUAL REMOTE ANTENNA C

Analog Devices Inc./Maxim Integrated

0
RFQ

-

- 16-LSSOP (0.154", 3.90mm Width) Exposed Pad Tube Active Systems, Remote Power 2.1mA 4.5V ~ 28V -40°C ~ 105°C Automotive - Surface Mount 16-QSOP-EP
MC33FS8430G1ESR2 NXP USA Inc. electronic component

MC33FS8430G1ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33FS8430G2ESR2 NXP USA Inc. electronic component

MC33FS8430G2ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33FS8430G0ESR2 NXP USA Inc. electronic component

MC33FS8430G0ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0
RFQ

-

* 56-VFQFN Exposed Pad Tape & Reel (TR) Active - - - - - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8430G4ESR2 NXP USA Inc. electronic component

MC33FS8430G4ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
BM92T10MWV-ZE2 Rohm Semiconductor electronic component

BM92T10MWV-ZE2

USB TYPE-C PD CONTROL LSI, RECEI

Rohm Semiconductor

0
RFQ

Datasheet

- 40-VFQFN Exposed Pad Tape & Reel (TR) Obsolete USB, Type-C Controller - 4.75V ~ 20V -30°C ~ 105°C - - Surface Mount UQFN040V5050
MFS8406AMBP4ES NXP USA Inc. electronic component

MFS8406AMBP4ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

0
RFQ

Datasheet

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC35FS4507NAE NXP USA Inc. electronic component

MC35FS4507NAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33VR5500V0KSR2 NXP USA Inc. electronic component

MC33VR5500V0KSR2

1 BUCK, QM, INFOTAINMENT

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active SMPS Start-Up 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33VR5500V1KSR2 NXP USA Inc. electronic component

MC33VR5500V1KSR2

1 BUCK, QM, INFOTAINMENT

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active SMPS Start-Up 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MFS8612BMDA0ES NXP USA Inc. electronic component

MFS8612BMDA0ES

IC FS86 SYSTEM BASIS CHIP ASIL

NXP USA Inc.

0
RFQ

-

- 48-VFQFN Exposed Pad Tray Active Camera - 4.5V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-QFN (7x7)
MC33FS6503CAER2 NXP USA Inc. electronic component

MC33FS6503CAER2

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC33FS6521CAE NXP USA Inc. electronic component

MC33FS6521CAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC35FS4508NAER2 NXP USA Inc. electronic component

MC35FS4508NAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MVR5510AVMANEPR2 NXP USA Inc. electronic component

MVR5510AVMANEPR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMALEPR2 NXP USA Inc. electronic component

MVR5510AVMALEPR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6507LAE NXP USA Inc. electronic component

MC33FS6507LAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33PF8100FJESR2 NXP USA Inc. electronic component

MC33PF8100FJESR2

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100F3ESR2 NXP USA Inc. electronic component

MC33PF8100F3ESR2

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LTC3109EGN#TRPBF Analog Devices Inc. electronic component

LTC3109EGN#TRPBF

IC BOOST CONVERTER PMU 20SSOP

Analog Devices Inc.

0
RFQ

Datasheet

- 20-SSOP (0.154", 3.90mm Width) Tape & Reel (TR) Active Energy Harvesting 6mA 30mV ~ 500mV -40°C ~ 125°C - - Surface Mount 20-SSOP
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Power Management - Specialized Electronic Components

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Q1: What products are included in Power Management - Specialized?
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Q4: Do you support BOM sourcing?
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