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Power Management - Specialized

Photo Mfr. Part # Availability Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC33VR5500V3ESR2 NXP USA Inc. electronic component

MC33VR5500V3ESR2

VR5500

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V2ESR2 NXP USA Inc. electronic component

MC33VR5500V2ESR2

VR5500

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V1ESR2 NXP USA Inc. electronic component

MC33VR5500V1ESR2

VR5500

NXP USA Inc.

0
RFQ

Datasheet

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V0ESR2 NXP USA Inc. electronic component

MC33VR5500V0ESR2

VR5500

NXP USA Inc.

0
RFQ

Datasheet

* - Tape & Reel (TR) Active - - - - - - - -
UC29432DTRG4 Texas Instruments electronic component

UC29432DTRG4

IC ANLG CTRLR ADJ 8SOIC

Texas Instruments

0
RFQ

Datasheet

- 8-SOIC (0.154", 3.90mm Width) Tape & Reel (TR) Discontinued at Digi-Key Overvoltage Comparator, Optocoupler 500µA 2.2V ~ 24V -25°C ~ 85°C - - Surface Mount 8-SOIC
MC35FS6506NAE NXP USA Inc. electronic component

MC35FS6506NAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501NAE NXP USA Inc. electronic component

MC35FS4501NAE

FS4500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
LTC3331IUH#TRPBF Analog Devices Inc. electronic component

LTC3331IUH#TRPBF

IC REG BUCK/LDO SYNC 50MA 32QFN

Analog Devices Inc.

0
RFQ

Datasheet

- 32-WFQFN Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 1.8V ~ 5.5V, 3V ~ 19V -40°C ~ 125°C - - Surface Mount 32-QFN (5x5)
MVR5510AVMA6EPR2 NXP USA Inc. electronic component

MVR5510AVMA6EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA0EPR2 NXP USA Inc. electronic component

MVR5510AVMA0EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA4EPR2 NXP USA Inc. electronic component

MVR5510AVMA4EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMAHEPR2 NXP USA Inc. electronic component

MVR5510AVMAHEPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CCESR2 NXP USA Inc. electronic component

MC33PF8100CCESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EPESR2 NXP USA Inc. electronic component

MC33PF8100EPESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CFESR2 NXP USA Inc. electronic component

MC33PF8100CFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EQESR2 NXP USA Inc. electronic component

MC33PF8100EQESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EAESR2 NXP USA Inc. electronic component

MC33PF8100EAESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100ERESR2 NXP USA Inc. electronic component

MC33PF8100ERESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CHESR2 NXP USA Inc. electronic component

MC33PF8100CHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100A0ESR2 NXP USA Inc. electronic component

MC33PF8100A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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Power Management - Specialized Electronic Components

Explore Power Management - Specialized electronic components, related subcategories, product specifications, datasheets and sourcing options. We support original component procurement, BOM sourcing and RFQ services for engineers, distributors and global buyers.

Frequently Asked Questions

Q1: What products are included in Power Management - Specialized?
This category includes related Power Management - Specialized subcategories and electronic components from multiple manufacturers. Select a lower-level category to view available part numbers.

Q2: Can I request a quotation for Power Management - Specialized components?
Yes. Send us the part numbers and required quantities, and our team will provide sourcing and quotation support.

Q3: Are datasheets and technical information available?
Yes. Datasheets and technical information are available on supported final product pages and product listings.

Q4: Do you support BOM sourcing?
Yes. We support BOM matching, component procurement and alternative sourcing for Power Management - Specialized and other electronic components.