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Power Management - Specialized

Photo Mfr. Part # Availability Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC33VR5500V3ESR2 NXP USA Inc. electronic component

MC33VR5500V3ESR2

VR5500

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V2ESR2 NXP USA Inc. electronic component

MC33VR5500V2ESR2

VR5500

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V1ESR2 NXP USA Inc. electronic component

MC33VR5500V1ESR2

VR5500

NXP USA Inc.

0
RFQ

Datasheet

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V0ESR2 NXP USA Inc. electronic component

MC33VR5500V0ESR2

VR5500

NXP USA Inc.

0
RFQ

Datasheet

* - Tape & Reel (TR) Active - - - - - - - -
UC29432DTRG4 Texas Instruments electronic component

UC29432DTRG4

IC ANLG CTRLR ADJ 8SOIC

Texas Instruments

0
RFQ

Datasheet

- 8-SOIC (0.154", 3.90mm Width) Tape & Reel (TR) Discontinued at Digi-Key Overvoltage Comparator, Optocoupler 500µA 2.2V ~ 24V -25°C ~ 85°C - - Surface Mount 8-SOIC
MC35FS6506NAE NXP USA Inc. electronic component

MC35FS6506NAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501NAE NXP USA Inc. electronic component

MC35FS4501NAE

FS4500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
LTC3331IUH#TRPBF Analog Devices Inc. electronic component

LTC3331IUH#TRPBF

IC REG BUCK/LDO SYNC 50MA 32QFN

Analog Devices Inc.

0
RFQ

Datasheet

- 32-WFQFN Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 1.8V ~ 5.5V, 3V ~ 19V -40°C ~ 125°C - - Surface Mount 32-QFN (5x5)
MVR5510AVMA6EPR2 NXP USA Inc. electronic component

MVR5510AVMA6EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA0EPR2 NXP USA Inc. electronic component

MVR5510AVMA0EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA4EPR2 NXP USA Inc. electronic component

MVR5510AVMA4EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMAHEPR2 NXP USA Inc. electronic component

MVR5510AVMAHEPR2

IC PMIC VR5510 QM

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CCESR2 NXP USA Inc. electronic component

MC33PF8100CCESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EPESR2 NXP USA Inc. electronic component

MC33PF8100EPESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CFESR2 NXP USA Inc. electronic component

MC33PF8100CFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EQESR2 NXP USA Inc. electronic component

MC33PF8100EQESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EAESR2 NXP USA Inc. electronic component

MC33PF8100EAESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100ERESR2 NXP USA Inc. electronic component

MC33PF8100ERESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CHESR2 NXP USA Inc. electronic component

MC33PF8100CHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100A0ESR2 NXP USA Inc. electronic component

MC33PF8100A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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Power Management - Specialized Electronic Components

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