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Power Management - Specialized

Photo Mfr. Part # Availability Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
RAA2214904GNP#HBB Renesas Electronics Corporation electronic component

RAA2214904GNP#HBB

4X6 STD QFN (REVD+G1B; HS_SHORT_

Renesas Electronics Corporation

0
RFQ

-

- - Tape & Reel (TR) Active - - - - - - - -
MAX13362ATL/V+T Analog Devices Inc./Maxim Integrated electronic component

MAX13362ATL/V+T

IC SWITCH 24 CHANNEL 40TQFN

Analog Devices Inc./Maxim Integrated

0
RFQ

Datasheet

- 40-WFQFN Exposed Pad Tape & Reel (TR) Active Contact Monitor 100nA 3V ~ 5.5V -40°C ~ 125°C Automotive AEC-Q100 Surface Mount 40-TQFN (6x6)
MC33FS6517CAE NXP USA Inc. electronic component

MC33FS6517CAE

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6518CAER2 NXP USA Inc. electronic component

MC33FS6518CAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501CAER2 NXP USA Inc. electronic component

MC35FS4501CAER2

FS4500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MFS8412AMBP8ES NXP USA Inc. electronic component

MFS8412AMBP8ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

0
RFQ

Datasheet

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MFS8412AMBP7ES NXP USA Inc. electronic component

MFS8412AMBP7ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

0
RFQ

Datasheet

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
BM92T30MWV-ZE2 Rohm Semiconductor electronic component

BM92T30MWV-ZE2

USB TYPE-C PD CONTROL LSI, RECEI

Rohm Semiconductor

0
RFQ

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Obsolete USB, Type-C Controller - 4.75V ~ 20V -30°C ~ 105°C - - Surface Mount UQFN040V5050
BM92T50MWV-ZE2 Rohm Semiconductor electronic component

BM92T50MWV-ZE2

USB TYPE-C PD CONTROL LSI, DC IN

Rohm Semiconductor

0
RFQ

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Obsolete USB, Type-C Controller - 4.75V ~ 20V -30°C ~ 105°C - - Surface Mount UQFN040V5050
MC35FS6508NAER2 NXP USA Inc. electronic component

MC35FS6508NAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6507NAE NXP USA Inc. electronic component

MC35FS6507NAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS8510A2ESR2 NXP USA Inc. electronic component

MC33FS8510A2ESR2

SYSTEM BASIS CHIP FS8500

NXP USA Inc.

0
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33FS8510B6ESR2 NXP USA Inc. electronic component

MC33FS8510B6ESR2

FS8500

NXP USA Inc.

0
RFQ

-

- - Tape & Reel (TR) Active - - - - - - - -
MC33FS8510D3ESR2 NXP USA Inc. electronic component

MC33FS8510D3ESR2

FS8510

NXP USA Inc.

0
RFQ

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Power Supplies - 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
AS3650-BCTP ams-OSRAM USA INC. electronic component

AS3650-BCTP

IC PMU POWER/AUDIO 124-CTBGA

ams-OSRAM USA INC.

0
RFQ

-

- - Tape & Reel (TR) Obsolete - - - - - - - -
MC35FS6501CAER2 NXP USA Inc. electronic component

MC35FS6501CAER2

FS6500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6512LAE NXP USA Inc. electronic component

MC33FS6512LAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC34PF8100A0EP NXP USA Inc. electronic component

MC34PF8100A0EP

IC POWER MANAGEMENT

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount 56-HVQFN (8x8)
MC34PF8100CHEP NXP USA Inc. electronic component

MC34PF8100CHEP

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount 56-HVQFN (8x8)
MC34PF8100CFEP NXP USA Inc. electronic component

MC34PF8100CFEP

IC POWER MANAGEMENT I.MX8QXP

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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Power Management - Specialized Electronic Components

Explore Power Management - Specialized electronic components, related subcategories, product specifications, datasheets and sourcing options. We support original component procurement, BOM sourcing and RFQ services for engineers, distributors and global buyers.

Frequently Asked Questions

Q1: What products are included in Power Management - Specialized?
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Q3: Are datasheets and technical information available?
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Q4: Do you support BOM sourcing?
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