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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
0078001802 Laird Technologies EMI electronic component

0078001802

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Ultrasoft Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.543" (13.79mm) 0.110" (2.79mm) Beryllium Copper - - Slot 121°C
0078004717 Laird Technologies EMI electronic component

0078004717

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Ultrasoft Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.543" (13.79mm) 0.110" (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
67SLG050050030PI00 Laird Technologies EMI electronic component

67SLG050050030PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

0
RFQ

Datasheet

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.197" (5.00mm) 0.118" (3.00mm) 0.197" (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
331021483033 Würth Elektronik electronic component

331021483033

RFI SOLDER

Würth Elektronik

0
RFQ

-

WE-SECF Tape & Reel (TR) Active - - - - - - - - Solder -
0077001902 Laird Technologies EMI electronic component

0077001902

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.730" (18.54mm) 0.110" (2.79mm) Beryllium Copper - - Slot 121°C
0077002302 Laird Technologies EMI electronic component

0077002302

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.370" (9.40mm) 0.225" (5.71mm) 0.130" (3.30mm) Beryllium Copper - - Slot 121°C
0077002402 Laird Technologies EMI electronic component

0077002402

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.370" (9.40mm) 0.475" (12.07mm) 0.130" (3.30mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Slot 121°C
0077004802 Laird Technologies EMI electronic component

0077004802

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.320" (8.13mm) 0.730" (18.54mm) 0.110" (2.79mm) Beryllium Copper - - Slot 121°C
0077006202 Laird Technologies EMI electronic component

0077006202

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper - - Slot 121°C
0077001619 Laird Technologies EMI electronic component

0077001619

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

-

77 Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
0077001519 Laird Technologies EMI electronic component

0077001519

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

-

77 Bulk Active Fingerstock - 0.600" (15.24mm) 0.250" (6.35mm) 0.220" (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
0077003917 Laird Technologies EMI electronic component

0077003917

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

-

77 Bulk Active Fingerstock - 0.787" (20.00mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
67BXG2503504008R00 Laird Technologies EMI electronic component

67BXG2503504008R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0
RFQ

Datasheet

BXG Bulk Active Fingerstock - 0.098" (2.50mm) 0.138" (3.50mm) 0.157" (4.00mm) Beryllium Copper Gold - Solder -
0077004402 Laird Technologies EMI electronic component

0077004402

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.320" (8.13mm) 1.104" (28.04mm) 0.110" (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Slot 121°C
77-1J-3120-09600 Parker Chomerics electronic component

77-1J-3120-09600

SS3500 FOF 0.078X0.236IN 96"

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3500 Box Active Fabric Over Foam Rectangle 0.236" (5.99mm) 8.00' (2.44m) 0.078" (1.98mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 70°C
77-12-3120-09600 Parker Chomerics electronic component

77-12-3120-09600

SS3500 FOF 0.078X0.236IN 96"

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3500 Box Active Fabric Over Foam Rectangle 0.236" (5.99mm) 8.00' (2.44m) 0.078" (1.98mm) Nickel-Copper Taffeta (NI/CU) Nickel - Adhesive -40°C ~ 70°C
0077005502 Laird Technologies EMI electronic component

0077005502

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.320" (8.13mm) 1.852" (47.04mm) 0.110" (2.79mm) Beryllium Copper - - Slot 121°C
10116040-001LF Amphenol ICC (FCI) electronic component

10116040-001LF

RFI FINGERSTOCK CU TIN

Amphenol ICC (FCI)

0
RFQ

Datasheet

- Tape & Reel (TR) Active Fingerstock - 0.378" (9.60mm) 0.827" (21.00mm) 0.272" (6.90mm) Copper Alloy Tin - - -
331021483040 Würth Elektronik electronic component

331021483040

RFI SHLD FINGER BECU GOLD SOLDER

Würth Elektronik

0
RFQ

Datasheet

WE-SECF Tape & Reel (TR) Active Shield Finger - 0.118" (3.00mm) 0.189" (4.80mm) 0.157" (4.00mm) Beryllium Copper Gold - Solder -40°C ~ 100°C
67B8G2507006215R00 Laird Technologies EMI electronic component

67B8G2507006215R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.098" (2.50mm) 0.276" (7.00mm) 0.244" (6.20mm) Beryllium Copper Gold - Solder -
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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