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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
4788PB51H00100 Laird Technologies EMI electronic component

4788PB51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

Datasheet

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.250" (6.35mm) 1.000" (25.40mm) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
2040761-1 TE Connectivity AMP Connectors electronic component

2040761-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

0
RFQ

Datasheet

- Tape & Reel (TR) Obsolete Shield Finger, Pre-Loaded - 0.079" (2.00mm) 0.204" (5.17mm) 0.078" (1.99mm) Copper Alloy Gold Flash Solder -
67SLG040040025PI00 Laird Technologies EMI electronic component

67SLG040040025PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

0
RFQ

Datasheet

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.157" (4.00mm) 0.098" (2.50mm) 0.157" (4.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
S1711-06R Harwin Inc. electronic component

S1711-06R

RFI SHLD CLIP SS TIN SOLDER

Harwin Inc.

0
RFQ

-

EZ BoardWare Tape & Reel (TR) Obsolete Shield Clip - 0.090" (2.28mm) 0.346" (8.79mm) 0.140" (3.55mm) Stainless Steel Tin 118.11µin (3.00µm) Solder -40°C ~ 125°C
4084AA51K00100 Laird Technologies EMI electronic component

4084AA51K00100

RFI FOF GASKET PU

Laird Technologies EMI

0
RFQ

Datasheet

51K Bulk Active Fabric Over Foam Square 0.500" (12.70mm) 1.000" (25.40mm) 0.500" (12.70mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4692PA51G00200 Laird Technologies EMI electronic component

4692PA51G00200

RFI FOF GASKET ADH

Laird Technologies EMI

0
RFQ

Datasheet

51G Bulk Active Fabric Over Foam D-Shape 0.252" (6.40mm) 2.000" (50.80mm) 0.142" (3.60mm) - - - Adhesive -
67B7G2504005010R00 Laird Technologies EMI electronic component

67B7G2504005010R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.098" (2.50mm) 0.157" (4.00mm) 0.197" (5.00mm) Beryllium Copper Gold - Solder -
0077001615 Laird Technologies EMI electronic component

0077001615

RFI FINGERSTOCK BECU ZINC SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Zinc + Clear Chromate 299.21µin (7.60µm) Slot 121°C
67SLH050050030PI00 Laird Technologies EMI electronic component

67SLH050050030PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

0
RFQ

Datasheet

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.197" (5.00mm) 0.118" (3.00mm) 0.197" (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
77-1N-3617-09600 Parker Chomerics electronic component

77-1N-3617-09600

SOFT-SHIELD 3500, FOF, D-SHAPE

Parker Chomerics

0
RFQ

Datasheet

SOFT-SHIELD® 3500 Spool Active Fabric Over Foam D-Shape 0.197" (5.00mm) 96.000" (2.44m) 0.256" (6.50mm) Nickel-Copper Taffeta over Urethane Foam - Halogen Free Nickel - Adhesive -40°C ~ 70°C
67B5G4004005108R0B Laird Technologies EMI electronic component

67B5G4004005108R0B

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0
RFQ

Datasheet

B5G Bulk Active Fingerstock - 0.157" (4.00mm) 0.157" (4.00mm) 0.201" (5.10mm) Beryllium Copper Gold - Solder -
0077001817 Laird Technologies EMI electronic component

0077001817

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.543" (13.79mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077001617 Laird Technologies EMI electronic component

0077001617

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077001717 Laird Technologies EMI electronic component

0077001717

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.356" (9.04mm) 0.110" (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
0077001719 Laird Technologies EMI electronic component

0077001719

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.356" (9.04mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.99µin (7.62µm) Slot 121°C
0077001819 Laird Technologies EMI electronic component

0077001819

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.543" (13.79mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
0077002417 Laird Technologies EMI electronic component

0077002417

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.370" (9.40mm) 0.475" (12.07mm) 0.130" (3.30mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077006217 Laird Technologies EMI electronic component

0077006217

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077006219 Laird Technologies EMI electronic component

0077006219

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
0078001519 Laird Technologies EMI electronic component

0078001519

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0
RFQ

Datasheet

Ultrasoft Slot Mount Bulk Active Fingerstock - 0.600" (15.24mm) 0.250" (6.35mm) 0.220" (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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