Microcontrollers, Microprocessor, FPGA Modules

Mfr. Part #	Availability	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0600-04-52I11-M IC MODULE GIGABEE Trenz Electronic GmbH	4	RFQ	-	-	Bulk	Active	FPGA	Xilinx Spartan™ 6 XC6SLX45-2FGG484I	-	100MHz	16MB	128MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0725-04-72I-1-B IC MOD ARTIX-7 A100T 100MHZ 32MB Trenz Electronic GmbH	18	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-
TE0720-04-61C33MA SOC MODULE WITH XILINX ZYNQ 7020 Trenz Electronic GmbH	9	RFQ	-	TE0722	Bulk	Active	MPU Core	Zynq™ XC7Z020-1CLG484C	ARM Cortex-A9	-	32MB	8GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0630-03-63I12-A FPGA MODULE WITH AMD SPARTAN 6 L Trenz Electronic GmbH	5	RFQ	-	Spartan	Bulk	Active	FPGA	Xilinx Spartan™ 6 XC6SLX75-3CSG484I	-	-	8MB	128MB	Board-to-Board (BTB) Socket - 80	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0712-03-71I36-A FPGA MODULE ARTIX7 Trenz Electronic GmbH	9	RFQ	-	TE0712	Bulk	Active	FPGA Core	Artix-7 XC7A100T-1FGG484I	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0600-04-72C11-A IC MODULE GIGABEE Trenz Electronic GmbH	5	RFQ	-	-	Bulk	Active	FPGA	Xilinx Spartan™ 6 XC6SLX100-2FGG484C	-	125MHz	16MB	128MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0803-04-2AE11-A IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	5	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0712-03-82C36-L FPGA MODULE ARTIX7 Trenz Electronic GmbH	5	RFQ	Datasheet	-	Bulk	Active	FPGA Core	Artix-7 XC7A200T-2FBG484C	-	-	32MB	1GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0813-02-2AE81-A MPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH	10	RFQ	-	Zynq UltraScale+	Bulk	Active	MPU Core	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0820-05-2AI81MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	5	RFQ	-	-	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU2CG-1SFVC784I	-	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0713-03-82C46-A IC SOM ARTIX-7 FPGA DDR3 Trenz Electronic GmbH	19	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-
TE0715-05-71I33-L IC SOC MODULE Trenz Electronic GmbH	10	RFQ	-	-	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0600-04-83I21-A IC MODULE GIGABEE Trenz Electronic GmbH	5	RFQ	-	-	Bulk	Active	FPGA	Xilinx Spartan™ 6 XC6SLX150-3FGG484I	-	125MHz	16MB	512MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0600-04-83I11-A IC MODULE GIGABEE Trenz Electronic GmbH	5	RFQ	-	-	Bulk	Active	FPGA	Xilinx Spartan™ 6 XC6SLX150-3FGG484I	-	125MHz	16MB	128MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0728-04-1Q IC MODULE CORTEX-A9 512MB Trenz Electronic GmbH	5	RFQ	Datasheet	TE0728	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	16MB	512MB	Samtec SEM	2.360" L x 2.360" W (60.00mm x 60.00mm)	-
TE0803-04-4BE11-A IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0745-03-71I31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	4	RFQ	-	Zynq® UltraScale+™	Bulk	Active	FPGA	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0813-02-4BE81-A MODULE MPSOC 4GB DDR4 Trenz Electronic GmbH	3	RFQ	-	Zynq® UltraScale+™	Box	Active	FPGA	Xilinx Zynq UltraScale+ ZU4EG	-	-	128MB	2GB	BGA	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4DE21-L IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	4	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4GE21-L MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	10	RFQ	-	TE0803	Bulk	Active	MPU Core	Zynq™ UltraScale+™ XCZU4EG-2SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C

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Microcontrollers, Microprocessor, FPGA Modules Electronic Components

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