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Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
OSD3358-512M-IND Octavo Systems LLC electronic component

OSD3358-512M-IND

IC MODULE CORTEX-A8 1GHZ 512MB

Octavo Systems LLC

0
RFQ

Datasheet

OSD335x Tray Active MPU Core ARM® Cortex®-A8, AM3358 NEON™ SIMD 1GHz - 512MB 400-BGA 1.060" L x 1.060" W (27.00mm x 27.00mm) -40°C ~ 85°C
S912XDG512J1CAGR NXP USA Inc. electronic component

S912XDG512J1CAGR

16-BIT MCU, S12X CORE, 512KB FLA

NXP USA Inc.

1,500
RFQ

-

- Tape & Reel (TR) Obsolete - - - - - - - - -
KCIMX6S6AVM08AC NXP USA Inc. electronic component

KCIMX6S6AVM08AC

KCIMX6S6AVM08AC

NXP USA Inc.

220
RFQ

-

- Bulk Obsolete - - - - - - - - -
MA5D4-20A0A051E ARIES Embedded electronic component

MA5D4-20A0A051E

SoM SAMA5D42

ARIES Embedded

110
RFQ

Datasheet

- Box Active - SAMA5D42 - 528MHz 4GB (NAND) 128MB - - -25°C ~ 85°C
M28-7BA1CI ARIES Embedded electronic component

M28-7BA1CI

SoM i.MX287

ARIES Embedded

290
RFQ

Datasheet

- Box Active - i.MX287 - 454MHz 256MB (NAND) 128MB - - -40°C ~ 85°C
MYC-LR3568J-16E2D-180-I MYIR Tech Limited electronic component

MYC-LR3568J-16E2D-180-I

SOM Rockchip RK3568J

MYIR Tech Limited

35
RFQ

-

MYD-LR3568 Bulk Active MPU Core ARM® Cortex®-A55 - 2GHz 16GB 2GB 381 Pin 1.770" L x 1.690" W (45.00mm x 43.00mm) -20°C ~ 70°C
MYC-LR3576-32E4D-220-C MYIR Tech Limited electronic component

MYC-LR3576-32E4D-220-C

SOM Rockchip RK3576

MYIR Tech Limited

50
RFQ

-

MYC-LR3576 Bulk Active MPU Core ARM® Cortex®-A53, ARM® Cortex®-A72 - 1.8GHz, 2.2GHz 32GB 4GB 381 Pin 1.770" L x 1.690" W (45.00mm x 43.00mm) 0°C ~ 70°C
MYC-JX8MMA7-8E2D-32Q256D-180-C MYIR Tech Limited electronic component

MYC-JX8MMA7-8E2D-32Q256D-180-C

ARM i.MX 8M Mini + Artix-7 FPGA

MYIR Tech Limited

40
RFQ

Datasheet

MYC-JX8MMA7 Bulk Active MPU, FPGA ARM® Cortex®-A53, ARM® Cortex®-M4 Xilinx Artix-7 XC7A25T 1.8GHz 8GB eMMC, 32MB QSPI 2GB Pin(s) 3.228" L x 1.772" W (82.00mm x 45.00mm) -40°C ~ 105°C
MCV-2DB ARIES Embedded electronic component

MCV-2DB

SoM CycloneV SoC-FPGA

ARIES Embedded

50
RFQ

Datasheet

- Box Active FPGA ARM Cortex-A9 (Dual Core) - 600MHz 4GB 1GB 360 Pin 2.910" L x 1.650" W (74.00mm x 42.00mm) 0°C ~ 70°C
MCV-6DB ARIES Embedded electronic component

MCV-6DB

SoM CycloneV SoC-FPGA

ARIES Embedded

30
RFQ

Datasheet

- Box Active FPGA ARM Cortex-A9 (Dual Core) - 800MHz 4GB 1GB 360 Pin 2.910" L x 1.650" W (74.00mm x 42.00mm) 0°C ~ 70°C
MCV-X6DB ARIES Embedded electronic component

MCV-X6DB

SoM CycloneV SoC-FPGA

ARIES Embedded

30
RFQ

Datasheet

- Box Active FPGA ARM Cortex-A9 (Dual Core) - 800MHz 4GB 1GB 360 Pin 2.910" L x 1.650" W (74.00mm x 42.00mm) 0°C ~ 70°C
ATSAMA5D27-SOM1 Microchip Technology electronic component

ATSAMA5D27-SOM1

IC MOD CORTEX-A5 500MHZ 1GB 64MB

Microchip Technology

25
RFQ

Datasheet

- Tray Active MPU Core ARM® Cortex®-A5 - 500MHz 64Mb Flash, 1Kb EEPROM 1Gb (128M x 8) Edge Connector 1.180" L x 1.570" W (30.00mm x 40.00mm) -40°C ~ 85°C (TA)
BS2-IC Parallax Inc. electronic component

BS2-IC

IC MOD PIC16C57C 20MHZ 32B 2KB

Parallax Inc.

89
RFQ

-

BASIC Stamp® Bulk Active MCU Core PIC16C57C - 20MHz 2KB EEPROM 32B - 1.200" L x 0.600" W (30.00mm x 15.00mm) 0°C ~ 70°C
ROM-2620WD-MDA1E Advantech Corp electronic component

ROM-2620WD-MDA1E

OSM

Advantech Corp

16
RFQ

-

- Box Active MCU Core ARM® Cortex®-A35, ARM® Cortex®-M33 - 1GHz 16GB 1GB USB 1.181" L x 1.181" W (30.00mm x 30.00mm) -40°C ~ 85°C
TE0720-04-61C530A Trenz Electronic GmbH electronic component

TE0720-04-61C530A

IC SOC MODULE XILINX ZYNQ

Trenz Electronic GmbH

21
RFQ

-

- Bulk Active Ethernet Core ARM® Cortex®-A9 - - 32MB 256MB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0720-04-62I33ML Trenz Electronic GmbH electronic component

TE0720-04-62I33ML

IC SOC MODULE XILINX ZYNQ

Trenz Electronic GmbH

11
RFQ

-

- Bulk Active Ethernet Core ARM® Cortex®-A9 - - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0720-04-61Q33MA Trenz Electronic GmbH electronic component

TE0720-04-61Q33MA

IC SOC MODULE XILINX ZYNQ

Trenz Electronic GmbH

24
RFQ

-

- Bulk Active Ethernet Core ARM® Cortex®-A9 - - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0720-04-62I33MA Trenz Electronic GmbH electronic component

TE0720-04-62I33MA

IC SOC MODULE XILINX ZYNQ

Trenz Electronic GmbH

2
RFQ

-

- Bulk Active Ethernet Core ARM® Cortex®-A9 - - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0712-03-81I36-A Trenz Electronic GmbH electronic component

TE0712-03-81I36-A

FPGA MODULE ARTIX7

Trenz Electronic GmbH

3
RFQ

-

TE0712 Bulk Active FPGA Core Artix-7 XC7A200T-1FBG484I - - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0712-03-82I36-A Trenz Electronic GmbH electronic component

TE0712-03-82I36-A

FPGA MODULE ARTIX7

Trenz Electronic GmbH

14
RFQ

-

TE0712 Bulk Active FPGA Core Artix-7 XC7A200T-2FBG484I - - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
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Microcontrollers, Microprocessor, FPGA Modules Electronic Components

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