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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
67SLH050050050PI00 Laird Technologies EMI electronic component

67SLH050050050PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

14,639
RFQ

Datasheet

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.197" (5.00mm) 0.197" (5.00mm) 0.197" (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
67SLG050060050PI00 Laird Technologies EMI electronic component

67SLG050060050PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

753
RFQ

Datasheet

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.197" (5.00mm) 0.197" (5.00mm) 0.236" (6.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
67SLH060100050PI00 Laird Technologies EMI electronic component

67SLH060100050PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

7,783
RFQ

Datasheet

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.236" (6.00mm) 0.197" (5.00mm) 0.394" (10.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
67B6G2007503015R00 Laird Technologies EMI electronic component

67B6G2007503015R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

886
RFQ

Datasheet

B6G Tape & Reel (TR) Active Fingerstock - 0.079" (2.00mm) 0.295" (7.50mm) 0.118" (3.00mm) Beryllium Copper Gold - Solder -
BMI-C-004 Laird Technologies EMI electronic component

BMI-C-004

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

5,411
RFQ

Datasheet

BMI-C Tape & Reel (TR) Active Fingerstock - 0.170" (4.32mm) 0.235" (5.97mm) 0.204" (5.17mm) Beryllium Copper Gold - Solder -
67B3G2504810010R00 Laird Technologies EMI electronic component

67B3G2504810010R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

2,085
RFQ

Datasheet

B3G Tape & Reel (TR) Active Fingerstock - 0.098" (2.50mm) 0.189" (4.80mm) 0.394" (10.00mm) Beryllium Copper Gold - Solder -
0097072802 Laird Technologies EMI electronic component

0097072802

GASKET BECU 15.88X11.35MM

Laird Technologies EMI

1,840
RFQ

Datasheet

USB Connector Bulk Active - - 0.625" (15.88mm) 0.447" (11.35mm) - - - - - -
4223PA51H01800 Laird Technologies EMI electronic component

4223PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

448
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.157" (4.00mm) 18.000" (457.20mm) 0.039" (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
4688PA51H01800 Laird Technologies EMI electronic component

4688PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,255
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.118" (3.00mm) 18.000" (457.20mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
4220PA51H01800 Laird Technologies EMI electronic component

4220PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

979
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 18.000" (457.20mm) 0.039" (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
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