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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
10156292-001TRLF Amphenol ICC (FCI) electronic component

10156292-001TRLF

RFI CU GOLD

Amphenol ICC (FCI)

3,000
RFQ

Datasheet

- Tape & Reel (TR) Active - - - - - Copper Alloy Gold Flash - -
67BCG2004705710R00 Laird Technologies EMI electronic component

67BCG2004705710R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

3,445
RFQ

Datasheet

BCG Bulk Active Fingerstock - 0.079" (2.00mm) 0.185" (4.70mm) 0.224" (5.70mm) Beryllium Copper Gold - Solder -
67B3G2507009010R0B Laird Technologies EMI electronic component

67B3G2507009010R0B

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

4,283
RFQ

Datasheet

B3G Tape & Reel (TR) Active Fingerstock - 0.098" (2.50mm) 0.276" (7.00mm) 0.354" (9.00mm) Beryllium Copper Gold - Solder -
67B5G2504506010R00 Laird Technologies EMI electronic component

67B5G2504506010R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

3,817
RFQ

Datasheet

B5G Bulk Active Fingerstock - 0.098" (2.50mm) 0.177" (4.50mm) 0.236" (6.00mm) Beryllium Copper Gold - Solder -
0077002902 Laird Technologies EMI electronic component

0077002902

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

1,230
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.800" (20.32mm) 0.343" (8.71mm) 0.320" (8.13mm) Beryllium Copper - - Slot 121°C
0077004102 Laird Technologies EMI electronic component

0077004102

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

1,461
RFQ

Datasheet

Slot Mount Box Active Fingerstock - 0.280" (7.11mm) 0.543" (13.79mm) 0.110" (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Slot 121°C
10151806-001TRLF Amphenol ICC (FCI) electronic component

10151806-001TRLF

28POSITIONS, 1.25MM COMPRESSION

Amphenol ICC (FCI)

4,000
RFQ

Datasheet

- Tape & Reel (TR) Active - - - - - Copper Alloy - - - -
0D97098317 Laird Technologies EMI electronic component

0D97098317

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

2,285
RFQ

Datasheet

Clip-On & Edge Mount Gaskets Bulk Active Fingerstock - 0.194" (4.93mm) 0.375" (9.52mm) 0.062" (1.57mm) Beryllium Copper Tin 299.99µin (7.62µm) Clip -
67B5G2003003108R00 Laird Technologies EMI electronic component

67B5G2003003108R00

RFI SHLD FINGER BECU NICKEL

Laird Technologies EMI

4,213
RFQ

Datasheet

B5G Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.118" (3.00mm) 0.122" (3.10mm) Beryllium Copper Nickel - - -
BMI-C-004-SN Laird Technologies EMI electronic component

BMI-C-004-SN

RFI SHLD FINGER BECU TIN SOLDER

Laird Technologies EMI

9,210
RFQ

Datasheet

BMI-C Tape & Reel (TR) Active Shield Finger - 0.170" (4.32mm) 0.235" (5.97mm) 0.204" (5.17mm) Beryllium Copper Tin - Solder -
331265563040 Würth Elektronik electronic component

331265563040

RFI SHLD FINGER BECU NICK SOLDER

Würth Elektronik

2,500
RFQ

Datasheet

WE-SECF Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.118" (3.00mm) 0.220" (5.59mm) 0.157" (4.00mm) Beryllium Copper Nickel - Solder -40°C ~ 100°C
331236362553 Würth Elektronik electronic component

331236362553

RFI SHLD FINGER PHOS NICK SOLDER

Würth Elektronik

1,900
RFQ

Datasheet

WE-SECF Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.110" (2.80mm) 0.142" (3.60mm) 0.209" (5.30mm) Phosphor Bronze Nickel - Solder -40°C ~ 100°C
8402010246 Laird Technologies EMI electronic component

8402010246

RFI GASKET BECU

Laird Technologies EMI

518
RFQ

Datasheet

Electronit Bulk Active Gasket Round 0.093" (2.36mm) - 0.093" (2.36mm) Beryllium Copper - - - -
4056AB51K01200 Laird Technologies EMI electronic component

4056AB51K01200

RFI FOF GASKET PU

Laird Technologies EMI

240
RFQ

Datasheet

51K Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 12.000" (304.80mm) 0.059" (1.50mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4912PA51G01800 Laird Technologies EMI electronic component

4912PA51G01800

RFI FOF GASKET ADH

Laird Technologies EMI

179
RFQ

Datasheet

51G Bulk Active Fabric Over Foam D-Shape 0.150" (3.80mm) 18.000" (457.20mm) 0.091" (2.30mm) - - - Adhesive -
4358AB51K01800 Laird Technologies EMI electronic component

4358AB51K01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

136
RFQ

-

51K Bulk Active Fabric Over Foam D-Shape 0.098" (2.49mm) 18.000" (457.20mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
8863-0100-89 Laird Technologies EMI electronic component

8863-0100-89

OSTRSD,ECE089 1.0MM FOOT

Laird Technologies EMI

1,239
RFQ

Datasheet

Electroseal™ EcE89 Digi-Spool®, Continuous Spool Active - - - Enter Number of Feet in Order Quantity - - - - - -
4049AB51K01500 Laird Technologies EMI electronic component

4049AB51K01500

RFI FOF GASKET PU

Laird Technologies EMI

153
RFQ

Datasheet

51K Bulk Active Fabric Over Foam Square 0.252" (6.40mm) 15.000" (381.00mm) 0.252" (6.40mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4694PA51H01200 Laird Technologies EMI electronic component

4694PA51H01200

RFI FOF GASKET PU ADH

Laird Technologies EMI

102
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.500" (12.70mm) 12.000" (304.80mm) 0.126" (3.20mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
8863-0184-89 Laird Technologies EMI electronic component

8863-0184-89

RFI EMI SHIELD MATERIAL FOOT

Laird Technologies EMI

1,121
RFQ

Datasheet

- Digi-Spool®, Continuous Spool Active - Round - Enter Number of Feet in Order Quantity 0.032" (0.81mm) - - - - -
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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