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RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
5411-0005-20 Leader Tech Inc. electronic component

5411-0005-20

.375"OD X .250"ID HOLLOW ROUND--

Leader Tech Inc.

0
RFQ

Datasheet

5401 Bag Active Gasket Round 0.250" (6.35mm) 25.00' (7.62m) 0.250" (6.35mm) Silver/Aluminum Fluorosilicone Elastomer - - Adhesive -55°C ~ 160°C
4795PA51G09600 Laird Technologies EMI electronic component

4795PA51G09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

51G Bulk Active Fabric Over Foam Rectangle 0.500" (12.70mm) 8.00' (2.44m) 0.250" (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 85°C
23-60FS-SNPB-24 Leader Tech Inc. electronic component

23-60FS-SNPB-24

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Lead, Tin Flash Adhesive -55°C ~ 121°C
4080PA51G09600 Laird Technologies EMI electronic component

4080PA51G09600

RFI FOF GASKET ADH

Laird Technologies EMI

0
RFQ

Datasheet

51G Bulk Active Fabric Over Foam Rectangle 1.000" (25.40mm) 96.000" (2.44m) 0.059" (1.50mm) - - - Adhesive -
10-26UD-BD-16 Leader Tech Inc. electronic component

10-26UD-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

TechMESH Bulk Active Fingerstock - 0.260" (6.60mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
4056PA51H09600 Laird Technologies EMI electronic component

4056PA51H09600

GK NICU PTAFG PU V0 REC

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active - - - - - - - - - -
4212PA51H09600 Laird Technologies EMI electronic component

4212PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

ECOGREEN™ Bulk Active Fabric Over Foam Square 0.195" (4.95mm) 8.00' (2.44m) 0.195" (4.95mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
4295PA51H09600 Laird Technologies EMI electronic component

4295PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

ECOGREEN™ Bulk Active Fabric Over Foam D-Shape 0.250" (6.35mm) 8.00' (2.44m) 0.170" (4.32mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
6-45LPH-060-ZNC-16 Leader Tech Inc. electronic component

6-45LPH-060-ZNC-16

RFI FINGERSTOCK BECU ZINC ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.450" (11.43mm) 16.000" (406.40mm) 0.060" (1.52mm) Beryllium Copper Zinc + Clear Chromate Flash Adhesive -55°C ~ 121°C
7-21C-045-DL-SNPB-24 Leader Tech Inc. electronic component

7-21C-045-DL-SNPB-24

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.250" (6.35mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Lead, Tin Flash Adhesive -55°C ~ 121°C
4233AB51K08400 Laird Technologies EMI electronic component

4233AB51K08400

RFI FOF GASKET PU

Laird Technologies EMI

0
RFQ

Datasheet

51K Bulk Active Fabric Over Foam Rectangle 1.000" (25.40mm) 84.000" (213.36cm) 0.598" (15.20mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4070AB51H09600 Laird Technologies EMI electronic component

4070AB51H09600

RFI FOF GASKET PU

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active Fabric Over Foam Rectangle 0.750" (19.10mm) 96.000" (2.44m) 0.375" (9.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - - -
19-05-14587-6502 Parker Chomerics electronic component

19-05-14587-6502

RFI GASKET ELASTOMER NICKEL

Parker Chomerics

0
RFQ

Datasheet

- Spool Active Gasket D-Shape 0.487" (12.37mm) 12.000" (304.80mm) 0.324" (8.23mm) Conductive Elastomer Nickel - No Adhesive -29°C ~ 66°C
25-109FSDS-SN-24 Leader Tech Inc. electronic component

25-109FSDS-SN-24

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 1.090" (27.69mm) 24.000" (609.60mm) 0.250" (6.35mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
11-28FS-BD-16 Leader Tech Inc. electronic component

11-28FS-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
8100-9020-82 Leader Tech Inc. electronic component

8100-9020-82

RFI GASKET ELASTOMER

Leader Tech Inc.

0
RFQ

Datasheet

- Bulk Active Gasket - - - - Conductive Elastomer - - - -62°C ~ 260°C
8417-3053-62 Laird Technologies EMI electronic component

8417-3053-62

RFI GASKET

Laird Technologies EMI

0
RFQ

-

Ultrasoft Knit Gaskets Bulk Active Gasket Rectangle 0.250" (6.40mm) 0.500" (12.70mm) 0.252" (6.40mm) - - - - -
4609PA51H09600 Laird Technologies EMI electronic component

4609PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active Fabric Over Foam D-Shape 0.402" (10.20mm) 96.000" (2.44m) 0.181" (4.60mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
4630PA51H09600 Laird Technologies EMI electronic component

4630PA51H09600

GK NICU PTAFG PU V0 BELL

Laird Technologies EMI

0
RFQ

Datasheet

51H Bulk Active - - - - - - - - - -
4626AB51H09600 Laird Technologies EMI electronic component

4626AB51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0
RFQ

-

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.608" (15.44mm) 8.00' (2.44m) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
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RFI and EMI - Contacts, Fingerstock and Gaskets Electronic Components

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