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Power Management - Specialized

Photo Mfr. Part # Availability Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC33PF8200DBESR2 NXP USA Inc. electronic component

MC33PF8200DBESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200EMESR2 NXP USA Inc. electronic component

MC33PF8200EMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETESR2 NXP USA Inc. electronic component

MC33PF8200ETESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200A0ESR2 NXP USA Inc. electronic component

MC33PF8200A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNESR2 NXP USA Inc. electronic component

MC33PF8200DNESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMESR2 NXP USA Inc. electronic component

MC33PF8200DMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFESR2 NXP USA Inc. electronic component

MC33PF8200DFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHESR2 NXP USA Inc. electronic component

MC33PF8200DHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESESR2 NXP USA Inc. electronic component

MC33PF8200ESESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXESR2 NXP USA Inc. electronic component

MC33PF8200CXESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
UCD9240RGCR Texas Instruments electronic component

UCD9240RGCR

IC DGTL PWM SYSTEM CTRLR 64VQFN

Texas Instruments

0
RFQ

Datasheet

Fusion Digital Power™ 64-VFQFN Exposed Pad Tape & Reel (TR) Active Special Purpose - 3V ~ 3.6V -40°C ~ 110°C - - Surface Mount 64-VQFN (9x9)
TWL6032A2B6YFFT Texas Instruments electronic component

TWL6032A2B6YFFT

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

0
RFQ

Datasheet

- 155-UFBGA, DSBGA Tape & Reel (TR) Discontinued at Digi-Key Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
MC35FS6512CAER2 NXP USA Inc. electronic component

MC35FS6512CAER2

FS6500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501CAE NXP USA Inc. electronic component

MC35FS4501CAE

FS4500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6501CAE NXP USA Inc. electronic component

MC35FS6501CAE

FS6500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34PF8100FJEP NXP USA Inc. electronic component

MC34PF8100FJEP

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tray Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LT8253AHUFDM#TRPBF Analog Devices Inc. electronic component

LT8253AHUFDM#TRPBF

40V USB TYPE-C PD 60W 4-SW BUCK-

Analog Devices Inc.

0
RFQ

Datasheet

- 28-WFQFN Exposed Pad Tape & Reel (TR) Active USB, Type-C Controller 2.1mA 4V ~ 40V -40°C ~ 150°C (TJ) - - Surface Mount, Wettable Flank 28-QFN (4x5)
MC35FS6508CAER2 NXP USA Inc. electronic component

MC35FS6508CAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34FS6407NAER2 NXP USA Inc. electronic component

MC34FS6407NAER2

SYSTEM BASIS CHIP CAN 5V 0.7

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C (TA) - - Surface Mount 48-HLQFP (7x7)
TPS65073RSLR Texas Instruments electronic component

TPS65073RSLR

IC PWR MGMT 5CH W/2 LDO 48VQFN

Texas Instruments

0
RFQ

Datasheet

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Mobile/OMAP™ - 2.8V ~ 6.3V -40°C ~ 85°C - - Surface Mount 48-VQFN (6x6)
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Power Management - Specialized Electronic Components

Explore Power Management - Specialized electronic components, related subcategories, product specifications, datasheets and sourcing options. We support original component procurement, BOM sourcing and RFQ services for engineers, distributors and global buyers.

Frequently Asked Questions

Q1: What products are included in Power Management - Specialized?
This category includes related Power Management - Specialized subcategories and electronic components from multiple manufacturers. Select a lower-level category to view available part numbers.

Q2: Can I request a quotation for Power Management - Specialized components?
Yes. Send us the part numbers and required quantities, and our team will provide sourcing and quotation support.

Q3: Are datasheets and technical information available?
Yes. Datasheets and technical information are available on supported final product pages and product listings.

Q4: Do you support BOM sourcing?
Yes. We support BOM matching, component procurement and alternative sourcing for Power Management - Specialized and other electronic components.