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Power Management - Specialized

Photo Mfr. Part # Availability Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC35FS6510CAER2 NXP USA Inc. electronic component

MC35FS6510CAER2

FS6500

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6501CAE NXP USA Inc. electronic component

MC33FS6501CAE

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
71M6403-IGT/F Analog Devices Inc./Maxim Integrated electronic component

71M6403-IGT/F

IC ELECTRONIC TRIP UNIT 100-LQFP

Analog Devices Inc./Maxim Integrated

0
RFQ

Datasheet

- 100-LQFP Bulk Discontinued at Digi-Key Electronic Trip Unit - - - - - Surface Mount 100-LQFP (14x14)
MFS2632AMDA0AD NXP USA Inc. electronic component

MFS2632AMDA0AD

AUTO SBC

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active - 30µA 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)
LM25066IPSQE/NOPB Texas Instruments electronic component

LM25066IPSQE/NOPB

IC PWR MGMT/PROT PMBUS 24WQFN

Texas Instruments

0
RFQ

Datasheet

- 24-WFQFN Exposed Pad Tape & Reel (TR) Active Base Station-Networking Line Cards, Servers 5.8mA 2.9V ~ 17V -40°C ~ 85°C - - Surface Mount 24-WQFN (4x5)
MC33FS6517LAER2 NXP USA Inc. electronic component

MC33FS6517LAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6518NAER2 NXP USA Inc. electronic component

MC33FS6518NAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33816AE NXP USA Inc. electronic component

MC33816AE

IC SOLENOID CTRLR PROGRAMMABLE

NXP USA Inc.

0
RFQ

-

- 64-LQFP Exposed Pad Tray Active Solenoid Controller - - -40°C ~ 125°C - - Surface Mount 64-LQFP (10x10)
MC33FS6526NAE NXP USA Inc. electronic component

MC33FS6526NAE

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 2.7V ~ 40V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MPF7100BMBA0ESR2 NXP USA Inc. electronic component

MPF7100BMBA0ESR2

POWER MANAGEMENT IC, I.MX 8, I.M

NXP USA Inc.

0
RFQ

Datasheet

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active i.MX Processors 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC34PF8100CFEPR2 NXP USA Inc. electronic component

MC34PF8100CFEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CCEPR2 NXP USA Inc. electronic component

MC34PF8100CCEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100A0EPR2 NXP USA Inc. electronic component

MC34PF8100A0EPR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100F3EPR2 NXP USA Inc. electronic component

MC34PF8100F3EPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CHEPR2 NXP USA Inc. electronic component

MC34PF8100CHEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EPEPR2 NXP USA Inc. electronic component

MC34PF8100EPEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EREPR2 NXP USA Inc. electronic component

MC34PF8100EREPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EQEPR2 NXP USA Inc. electronic component

MC34PF8100EQEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0
RFQ

Datasheet

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
BQ501210RGCR Texas Instruments electronic component

BQ501210RGCR

WIRELESS POWER MEDIUM POWER TRAN

Texas Instruments

0
RFQ

Datasheet

- 64-VFQFN Exposed Pad Tape & Reel (TR) Not For New Designs Wireless Power Transmitter 52mA 3V ~ 3.6V -40°C ~ 85°C - - Surface Mount 64-VQFN (9x9)
MC35FS4505CAE NXP USA Inc. electronic component

MC35FS4505CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0
RFQ

Datasheet

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
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Power Management - Specialized Electronic Components

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