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Memory

Photo Mfr. Part # Availability Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
S29GL512S10DHSS43 Infineon Technologies electronic component

S29GL512S10DHSS43

IC FLASH 512MBIT PARALLEL 64FBGA

Infineon Technologies

0
RFQ

-

GL-S 64-LBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 32M x 16 Parallel - 60ns 100 ns 2.7V ~ 3.6V 0°C ~ 85°C (TA) - - Surface Mount 64-FBGA (9x9)
S29GL512S10DHSS63 Infineon Technologies electronic component

S29GL512S10DHSS63

IC FLASH 512MBIT PARALLEL 64FBGA

Infineon Technologies

0
RFQ

-

GL-S 64-LBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 32M x 16 Parallel - 60ns 100 ns 2.7V ~ 3.6V 0°C ~ 85°C (TA) - - Surface Mount 64-FBGA (9x9)
S29GL512S11DHI023 Infineon Technologies electronic component

S29GL512S11DHI023

IC FLASH 512MBIT PARALLEL 64FBGA

Infineon Technologies

0
RFQ

Datasheet

GL-S 64-LBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 32M x 16 Parallel - 60ns 110 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 64-FBGA (9x9)
S29GL512S11DHIV13 Infineon Technologies electronic component

S29GL512S11DHIV13

IC FLASH 512MBIT PARALLEL 64FBGA

Infineon Technologies

0
RFQ

Datasheet

GL-S 64-LBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 32M x 16 Parallel - 60ns 110 ns 1.65V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 64-FBGA (9x9)
IS25WP512M-RHLA3 ISSI, Integrated Silicon Solution Inc electronic component

IS25WP512M-RHLA3

IC FLSH 512MBIT SPI/QUAD 24TFBGA

ISSI, Integrated Silicon Solution Inc

0
RFQ

Datasheet

- 24-TBGA Bulk Active Not Verified Non-Volatile FLASH FLASH - NOR (SLC) 512Mbit 64M x 8 SPI - Quad I/O, QPI, DTR 112 MHz 50µs, 1ms 7.5 ns 1.7V ~ 1.95V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 24-TFBGA (6x8)
MT29F8G08ABACAM71M3WC1L Micron Technology Inc. electronic component

MT29F8G08ABACAM71M3WC1L

IC FLASH 8GBIT ONFI DIE

Micron Technology Inc.

0
RFQ

-

- Die Box Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 8Gbit 1G x 8 ONFI - 20ns 20 ns 2.7V ~ 3.6V 0°C ~ 70°C (TA) - - - Die
MT29F8G08ABBCAM71M3WC1L Micron Technology Inc. electronic component

MT29F8G08ABBCAM71M3WC1L

IC FLASH 8GBIT ONFI DIE

Micron Technology Inc.

0
RFQ

-

- Die Box Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 8Gbit 1G x 8 ONFI - 25ns 25 ns 1.7V ~ 1.95V 0°C ~ 70°C (TA) - - - Die
MT53E512M16D1FW-046 WT:D Micron Technology Inc. electronic component

MT53E512M16D1FW-046 WT:D

IC DRAM 8GBIT PAR 200TFBGA

Micron Technology Inc.

0
RFQ

-

- 200-TFBGA Tray Last Time Buy - - DRAM SDRAM - Mobile LPDDR4 8Gbit 512M x 16 - - - - - - - - Surface Mount 200-TFBGA (10x14.5)
S29GL256S10TFB023 Infineon Technologies electronic component

S29GL256S10TFB023

IC FLASH 256MBIT PARALLEL 56TSOP

Infineon Technologies

0
RFQ

Datasheet

GL-S 56-TFSOP (0.724", 18.40mm Width) Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 256Mbit 16M x 16 Parallel - 60ns 100 ns 2.7V ~ 3.6V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount 56-TSOP
S29GL256S10TFB013 Infineon Technologies electronic component

S29GL256S10TFB013

IC FLASH 256MBIT PARALLEL 56TSOP

Infineon Technologies

0
RFQ

Datasheet

GL-S 56-TFSOP (0.724", 18.40mm Width) Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 256Mbit 16M x 16 Parallel - 60ns 100 ns 2.7V ~ 3.6V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount 56-TSOP
IS42S32800G-6BL ISSI, Integrated Silicon Solution Inc electronic component

IS42S32800G-6BL

IC DRAM 256MBIT PAR 90TFBGA

ISSI, Integrated Silicon Solution Inc

0
RFQ

Datasheet

- 90-TFBGA Tray Obsolete Not Verified Volatile DRAM SDRAM 256Mbit 8M x 32 Parallel 166 MHz - 5.4 ns 3V ~ 3.6V 0°C ~ 70°C (TA) - - Surface Mount 90-TFBGA (8x13)
MT46V128M4TG-6T:F TR Micron Technology Inc. electronic component

MT46V128M4TG-6T:F TR

IC DRAM 512MBIT PAR 66TSOP

Micron Technology Inc.

0
RFQ

Datasheet

- 66-TSSOP (0.400", 10.16mm Width) Tape & Reel (TR) Obsolete Not Verified Volatile DRAM SDRAM - DDR 512Mbit 128M x 4 Parallel 167 MHz 15ns 700 ps 2.3V ~ 2.7V 0°C ~ 70°C (TA) - - Surface Mount 66-TSOP
MT48LC32M8A2TG-75 IT:D TR Micron Technology Inc. electronic component

MT48LC32M8A2TG-75 IT:D TR

IC DRAM 256MBIT PAR 54TSOP II

Micron Technology Inc.

0
RFQ

Datasheet

- 54-TSOP (0.400", 10.16mm Width) Tape & Reel (TR) Obsolete Not Verified Volatile DRAM SDRAM 256Mbit 32M x 8 Parallel 133 MHz 15ns 5.4 ns 3V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 54-TSOP II
IS43R16320D-6TLI-TR ISSI, Integrated Silicon Solution Inc electronic component

IS43R16320D-6TLI-TR

IC DRAM 512MBIT PAR 66TSOP II

ISSI, Integrated Silicon Solution Inc

0
RFQ

Datasheet

- 66-TSSOP (0.400", 10.16mm Width) Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - DDR 512Mbit 32M x 16 Parallel 166 MHz 15ns 700 ps 2.3V ~ 2.7V -40°C ~ 85°C (TA) - - Surface Mount 66-TSOP II
AT28C256-15JU-043 Microchip Technology electronic component

AT28C256-15JU-043

IC EEPROM 256KBIT PAR 32PLCC

Microchip Technology

0
RFQ

Datasheet

- 32-LCC (J-Lead) Tape & Reel (TR) Active Not Verified Non-Volatile EEPROM EEPROM 256Kbit 32K x 8 Parallel - 10ms 150 ns 4.5V ~ 5.5V -40°C ~ 85°C (TC) - - Surface Mount 32-PLCC (13.97x11.43)
AT28C256-15JU-323 Microchip Technology electronic component

AT28C256-15JU-323

IC EEPROM 256KBIT PAR 32PLCC

Microchip Technology

0
RFQ

Datasheet

- 32-LCC (J-Lead) Tape & Reel (TR) Active Not Verified Non-Volatile EEPROM EEPROM 256Kbit 32K x 8 Parallel - 10ms 150 ns 4.5V ~ 5.5V -40°C ~ 85°C (TC) - - Surface Mount 32-PLCC (13.97x11.43)
CYDM128B16-40BVXI Infineon Technologies electronic component

CYDM128B16-40BVXI

IC SRAM 128KBIT PAR 100VFBGA

Infineon Technologies

0
RFQ

-

MOBL™ 100-VFBGA Tray Obsolete Not Verified Volatile SRAM SRAM - Dual Port, MoBL 128Kbit 8K x 16 Parallel - 40ns 40 ns 1.7V ~ 1.9V, 2.4V ~ 2.6V, 3V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 100-VFBGA (6x6)
S26KS128SDGBHN030 Infineon Technologies electronic component

S26KS128SDGBHN030

IC FLASH 128MBIT HYPERBUS 24FBGA

Infineon Technologies

0
RFQ

Datasheet

HYPERFLASH™ KS 24-VBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NOR 128Mbit 16M x 8 HyperBus 133 MHz - 96 ns 1.7V ~ 1.95V -40°C ~ 125°C (TA) - - Surface Mount 24-FBGA (6x8)
SST38VF6401-90-5I-B3KE-T Microchip Technology electronic component

SST38VF6401-90-5I-B3KE-T

IC FLASH 64MBIT PARALLEL 48TFBGA

Microchip Technology

0
RFQ

Datasheet

SST38 48-TFBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH 64Mbit 4M x 16 Parallel - 10µs 90 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 48-TFBGA (6x8)
IS45S16160G-7TLA2-TR ISSI, Integrated Silicon Solution Inc electronic component

IS45S16160G-7TLA2-TR

IC DRAM 256MBIT PAR 54TSOP II

ISSI, Integrated Silicon Solution Inc

0
RFQ

Datasheet

- 54-TSOP (0.400", 10.16mm Width) Tape & Reel (TR) Last Time Buy Not Verified Volatile DRAM SDRAM 256Mbit 16M x 16 Parallel 143 MHz - 5.4 ns 3V ~ 3.6V -40°C ~ 105°C (TA) - - Surface Mount 54-TSOP II

Memory Electronic Components

Explore Memory electronic components, related subcategories, product specifications, datasheets and sourcing options. We support original component procurement, BOM sourcing and RFQ services for engineers, distributors and global buyers.

Frequently Asked Questions

Q1: What products are included in Memory?
This category includes related Memory subcategories and electronic components from multiple manufacturers. Select a lower-level category to view available part numbers.

Q2: Can I request a quotation for Memory components?
Yes. Send us the part numbers and required quantities, and our team will provide sourcing and quotation support.

Q3: Are datasheets and technical information available?
Yes. Datasheets and technical information are available on supported final product pages and product listings.

Q4: Do you support BOM sourcing?
Yes. We support BOM matching, component procurement and alternative sourcing for Memory and other electronic components.