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System On Chip (SoC)
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPFS095T-FCVG484IIC SOC RISC-V 484FCBGA |
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Datasheet |
PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 857.6kB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 100°C | - | - | 484-FCBGA (19x19) |
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SOM-2533AN0C-S0A1SMARC N50 4GLPDDR5 EDP 32GEMMC 1 |
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Datasheet |
SMARC | Module | Box | Active | MPU | Intel® N50 | - | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.4GHz | - | 0°C ~ 60°C | - | - | - |
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SOM-2533BN0C-U0A1SMARC I3-N305 8GLPDDR5 32GEMMC 2 |
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Datasheet |
SMARC | Module | Box | Active | MPU | Intel® N97 | - | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.6GHz | - | 0°C ~ 60°C | - | - | - |
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MPFS160T-FCVG484IIC SOC RISC-V 484FCBGA |
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Datasheet |
PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 484-FCBGA (19x19) |
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SOM-2533CCBC-S5A1SMARC X7425E 8GLPDDR5 32GEMMC 2* |
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Datasheet |
SMARC | Module | Box | Active | MPU | Intel® Atom® x7425E | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.4GHz | - | 0°C ~ 60°C | - | - | - |
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MPFS160T-FCVG784IIC SOC RISC-V 784FCBGA |
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Datasheet |
PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 784-FCBGA (23x23) |
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SOM-2533BN0C-S0A1SMARC N200 4GLPDDR5 32GEMMC 2*LA |
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Datasheet |
SMARC | Module | Box | Active | MPU | Intel® N200 | - | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.7GHz | - | 0°C ~ 60°C | - | - | - |
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MPFS160T-1FCVG784IIC SOC RISC-V 784FCBGA |
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Datasheet |
PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 784-FCBGA (23x23) |
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SOM-2533DNCC-S8A1SMARC I3-N305 16GLPDDR5 64GEMMC |
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Datasheet |
SMARC | Module | Box | Active | MPU | Intel® i3-N305 | 64GB | 16GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.8GHz | - | 0°C ~ 60°C | - | - | - |
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XC7Z035-1FFG676IIC SOC CORTEX-A9 667MHZ 676FCBGA |
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Datasheet |
Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 275K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
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TE0835-03-TXE81-ARFSOC MODULE WITH XILINX ZYNQ UL |
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- | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
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SLG7NT41204VGEMINI LAKE RVP |
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- | 20-UFQFN | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | -40°C ~ 85°C (TA) | - | - | 20-STQFN (2x3) |
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QCC-743-1-MQFN40-MT-00-0QCC-743-1-MQFN40-MT-00-0. |
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Datasheet |
Qualcomm® QCC740 | 40-VFQFN | Tray | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 40-QFN (5x5) |
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QCC-743-1-MQFN40-TR-00-0QCC-743-1-MQFN40-TR-00-0. |
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Datasheet |
Qualcomm® QCC740 | 40-VFQFN | Tape & Reel (TR) | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 40-QFN (5x5) |
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BCM58101LB0KFBGLYNX - 100MHZ |
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* | - | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM60321KMLGBCM60321: 200MBPS POWERLINE |
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* | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
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QCC-744-2-MQFN56-TR-00-0QCC-744-2-MQFN56-TR-00-0. |
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Datasheet |
Qualcomm® QCC740 | 56-VFQFN | Tape & Reel (TR) | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 56-QFN (7x7) |
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QCC-744-2-MQFN56-MT-00-0QCC-744-2-MQFN56-MT-00-0. |
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Datasheet |
Qualcomm® QCC740 | 56-VFQFN | Tray | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 56-QFN (7x7) |
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MAX32655GXG+TM4 CORE 100MHZ, 512KB/128KB, NO |
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Datasheet |
DARWIN | 81-LFBGA | Tape & Reel (TR) | Active | MCU | ARM® Cortex®-M4F | 512KB | 128kB | DMA, I2S, PWM, WDT | Bluetooth, I2C, SPI, UART | 100MHz | - | -40°C ~ 105°C (TA) | - | - | 81-CTBGA (8x8) |
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BCM58101B0KFBGLYNX |
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* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
System On Chip (SoC) Electronic Components
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